LHY2092-S94-PF

LHY2092-S94-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 11 - Jan. - 2008 A LHY2092/S94-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR TYPE LED LAMPS LHY2092/S94-PF Lead-Free Parts Pb

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LHY2092/S94-PFPART NO. Page 1/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.CATHODE YELLOW 2.COMMON ANODE 3.CATHODE RED 31 2 HY PIN中間 5.2 4.2 3.0 4.0 2.54TYP 0.5TYP 5.0±0.5 2.54TYP 19.0MIN 2.0MIN 1 2 3 - + -

Tstg Storage Temperature -40 ~ +100 ℃ MATERIALPART NO Luminous intensity @10mA(mcd) Spectral halfwidth △λnm Peak wave length λPnm Forward voltage @ mA(V)20 Viewing angle 2θ 1/2 (deg) LHY2092/S94-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 1.7 1.7 Min. GaAsP/GaPYellow58535 White Diffused GaPRed Emitted 69790 Lens 2.61.83.0 70 2.60.10.5 70 Max. Min. Typ. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR Page2/6 Power Dissipation Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz Forward Current Absolute Maximum Ratings at Ta=25 ℃ 20IF 15 mA -40 ~ +85Topr Ir10 IFP PD 40 μA 60 mW 80 mA Ratings SymbolParameter HY UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY2092/S94-PF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 Page3/6PART NO. LHY2092/S94-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 Y CHIP Page4/6PART NO. LHY2092/S94-PF

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C) Page5/6PART NO. LHY2092/S94-PF

Description

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reliability Test: High Temperature Storage Test Operating Life Test Test Item Low Temperature Storage Test The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature High Humidity Test Solderability Test Solder Resistance Test Thermal Shock Test Page6/6PART NO. LHY2092/S94-PF