LHY11240-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905-LHY11240-PF REV. : A DATE : 03 - Dec - 2015 LHY11240-PF Pb Lead-Free Parts SUPER BRIGHT ROUND TYPE LED LAMPS 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Page 1/6 PART NO. LHY11240-PF Directivity Radiation 2.4 1.5MAX 1.6 3.0 □0.5 TYP 3.3 1.8 1.0MIN + - 2.54TYP 25.0MIN R1.7 30° -30° -60° 100%75%

Topr Operating Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO Storage Temperature Spectral halfwidth △λnm Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) Luminous intensity @20mA(mcd) Dominant wave length λDnm Emitted Lens Max.Min.Min. Typ. COLOR Tstg ℃ Absolute Maximum Ratings at Ta=25 ℃ Electrostatic Discharge( * ) Forward Current Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Parameter Page 2/6 Ratings IF ESD Ir PD IFP Symbol mA μA V mA mW HY UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHY11240-PF 2000 -40 ~ +85 -40 ~ +100 AlGaInP Yellow59515 1.7 2.67001100 50LHY11240-PF Yellow Diffused

PART NO. LHY11240-PF 100101.0 Forward Current(mA) 1000 Page3/6 3.02.52.0 Relative Intensity Normalize @20mA 1000 HY CHIP 1.0 0.1 1.0 Forward Current(mA) 100 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage 1.5 Typical Electro-Optical Characteristics Curve Fig.2 Relative Intensity vs. Forward Current LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 0.0 0.5 1.0 1.5 2.0 2.5 3.0 8040600-40-20 Ambient Temperature(℃) 20100801004060020 Relative Intensity@20mA Normalize @25℃ 1.2 1.1 0.9 1.0 -20 0.8 -40 1.0 Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) 650600 0.5 0.0 500 550 Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature 2.0 0.0 0.5 1.0 1.5 2.5 3.0

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 5°/sec max Temp(°C) 260° 260°C3sec Max 150100 Time(sec) 2°/sec max25° 00° Preheat Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) PART NO. LHY11240-PF

60 Seconds Max

MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Reliability Test: Low Temperature Storage Test Operating Life Test High Temperature Storage Test Test Item MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.

Description

PART NO. LHY11240-PF

H W H W ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs C/NO: MADE IN CHINA 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm L 2. 8 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L 1. 1000PCS / BAG PACKING SPECIFICATION Page 6/6