LHSE42292-L11-PF

LHSE42292-L11-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 29 - Sep.- 2006 LHSE42292/L11-PF A DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS Pb Lead-Free Parts

□0.5 TYP 18.0MIN 2.0TYP 2.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 2.0TYP 2.0MIN 123 1.ANODE ORANGE 2.COMMON CATHODE 3.ANODE RED 6.7±0.55.2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHSE42292/L11-PF 4.2

1.5 MAX

3.0 4.0Package Dimensions Page1/6 31 2 SE H

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA mW μA Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Tstg Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Operating Temperature Reverse Current @5V Storage Temperature Topr Ir PD -40 ~ +85 -40 ~ +100 Symbol Absolute Maximum Ratings at Ta=25 ℃ Forward Current Parameter Peak Forward Current Duty 1/10@10KHz IF IFP Ratings H Red LHSE42292/L11-PF GaP 1.7 1.7 59790 702.6 2.63.01.870 MATERIALPART NO Luminous intensity @10mA(mcd) Forward voltage @ mA(V) Peak wave length λPnm Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) Min.LensEmitted COLOR Typ.Min.Max. SE GaAsP/GaP Orange White Diffused 61045 4.58.0 LHSE42292/L11-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Forward Current(mA)Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) 600 Wavelength (nm) 1.0 Relative Intensity@20mA 500 0.0 0.5 0.9 Forward Voltage@20mA Normalize @25℃ -40 0.8 -20 1.0 1.1 1.2 700800900 3.0 2.0 1.0 1.5 2.5 Fig.4 Relative Intensity vs. Temperature 0.0 0.5 Relative Intensity@20mA Normalize @25℃ 804020060100 Ambient Temperature(℃) -40-20 020406080100 2.0 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage Forward Current(mA) 1.0 1.0 0.1 100 H CHIP 1000 3.0 Fig.2 Relative Intensity vs. Forward Current 2.5 2.0 0.5 1.0 1.5 0.0 3.04.0 Relative Intensity Normalize @20mA 5.01.0101001000 Page LHSE42292/L11-PFPART NO.

Typical Electro-Optical Characteristics Curve Relative Intensity Normalize @20mA Relative Intensity@20mA Normalize @25℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 0.0 Relative Intensity@20mA 550 Wavelength (nm) 600650700750 100406080020-40-20 Fig.5 Relative Intensity vs. Wavelength 0.5 1.0 Ambient Temperature(℃) Fig.3 Forward Voltage vs. Temperature 1.1 Forward Voltage@20mA Normalize @25℃ 0.9 0.8 1.0 1.2 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage 1.0 Forward Current(mA) 0.1 1.0 1000 100 2.03.04.05.0 SE CHIP 8060100200-20-40 40 Ambient Temperature(℃) 0.5 0.0 1.5 2.0 1.0 Fig.4 Relative Intensity vs. Temperature Forward Current(mA) 3.0 2.5 Fig.2 Relative Intensity vs. Forward Current 0.5 1.0 0.0 1.5 1.0 100 3.0 2.0 2.5 1000 Page4/6 LHSE42292/L11-PFPART NO.

2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 150 Time(sec) 260°C3sec Max 260° Temp(°C) 2°/sec max 10050Preheat 120° 25° 00° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

LHSE42292/L11-PFPART NO.

(10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Low Temperature Storage Test High Temperature Storage Test Test Item Reliability Test: Page6/6 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHSE42292/L11-PFPART NO.