LHRF3333-30-A-PF-B01 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DOC. NO : QW0905-LHRF3333-30/A-PF-B01 REV. : A DATE : 10- May. - 2013 SUPER BRIGHT ROUND TYPE LED LAMPS Pb Lead-Free Parts 發行 DCC 立碁電子

5.95.0 □0.5 TYP 1.5MAX 25.0MIN 8.67.6 1.0MIN 2.54TYP Page 1/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF3333-30/A-PF-B01 Package Dimensions Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. + - 100%75%50% -60° -30° 100%25%025%75% 50% 60° 30°

PART NO. LHRF3333-30/A-PF-B01 Min. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT HRF Ratings Page 2/6 SymbolParameter Absolute Maximum Ratings at Ta=25 ℃ mA mA mW μA ℃-40 ~ +100 -40 ~ +85 ℃ IF IFP PD Ir Forward Current Power Dissipation Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Tstg Storage Temperature Operating Temperature Topr Min. Typ. 2200305000 Max. 630201.5 2.4 Dominant wave length λDnm Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) Spectral halfwidth △λnm LensEmitted COLOR Water Clear Red PART NO LHRF3333-30/A-PF-B01 MATERIAL AlGaInP Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Electrostatic Discharge 2000ESDV

PART NO. LHRF3333-30/A-PF-B01 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4000A27 3400 77006200A30 5000 4000 A29 A28 6200 5000 Min. Luminous Intensity(mcd) at 20 mA Group Max. Bin CHIP Brightness Code For Standard LED Lamps Page 3/6 A25 2200 2700 A26 2700 3400

1.0 Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize@25℃ Ambient Temperature(℃) 650700550600 Wavelength (nm) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 Relative Intensity@20mA 0.9 0.8 -0-40-202040 1006080 -40-20 0.5 -0206080100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 1.0 0.1 100 1.01.52.0 1.5 2.0 2.5 3.0 Relative Intensity Normalize @20mA 3.02.51.0 0.5 2.0 1.5 1.0 2.5 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage HRF CHIP 1000 3.5 1000100 Page 4/6 PART NO. LHRF3333-30/A-PF-B01

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Dip Soldering Preheat: 120¢XC Max Preheat time: 60seconds Max Ramp-up 2¢XC/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350¢XC Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) PART NO. LHRF3333-30/A-PF-B01 150 Time(sec) 5¢X/sec max 260°C3sec Max Temp(¢XC) 260° 10050 120° 25° Preheat00° 2¢X/sec max

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

PART NO. LHRF3333-30/A-PF-B01 Reference Standard Page 6/6 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 DescriptionTest ConditionTest Item Reliability Test: This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Operating Life Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test The purpose of this test is the resistance of the device under tropical for hous. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test