LHR9S53

LHR9S53 LIGITEK | Alldatasheet

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SURFACE MOUNT TAPE AND REEL LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DOC. NO : QW0905-LHR9S53 REV. : A DATE : 25 - Dec. - 2006 LHR9S53

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.3 0.7 1.3 1.4 2.0 Page 1/6 0.7 PART NO. LHR9S53 Package Dimensions 3.0 2.7 30° 60° 100%50%75%025%25% -60° 75%100% Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 50% -30°

Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Symbol μA Ir Tstg Topr -40 ~ +100 -40 ~ +85 Storage Temperature Operating Temperature Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 Luminous intensity @20mA(mcd) 13070 322.4 Max. Min. Typ. Spectral halfwidth △λnm Peak wave length λPnm 20660 Forward voltage @20mA(V) Min. 1.5 MATERIAL Red GaAlAs Emitted LHR9S53 PART NO Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Lens COLOR Viewing angle 2θ 1/2 (deg) PART NO. LHR9S53

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 -40-20-020 600650 2.03.04.05.0 4060 0.8 -0-20-404060 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080100 80 2.5 3.0 HR CHIP Page3/6 PART NO. LHR9S53

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering heat Max. 260℃ 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Recommended Soldering Conditions 120 ~ 150℃ Preheat 120 ~ 180 sec 245±5℃ within 5 sec Page 4/6 240 Temp. (℃) Preheat 120 150 Cooling -5℃/sec Rising +5℃/sec 1~5°C/sec 60 ~ 120 sec 5sec 4. PB-Free Reflow Solder 260°C MaX. 10sec.Max Time Preheat 180~200 °C Above 220 °C 60 sec.Max.1~5°C/sec 120 sec.Max. Note:1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 3. LEAD Reflow Solder PART NO. LHR9S53

Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LEDLED Circuit model A Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Circuit model B Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. PART NO. LHR9S53

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883D:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 Test ConditionTest Item Operating Life Test Classification Reliability Test: High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Endurance Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Page 6/6 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020 Thermal Shock Test Solderability Test 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Immersion rate 25 ±2.5mm/sec 4.Immersion rate 25 ±2.5mm/sec 5.Coverage ≧95% of the dipped surface 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5℃& -40℃±5℃ (10min) (10min) 3.total 10 cycles Temperature Cycling 30mins 5mins 30mins 5mins

2.10 Cyeles

Ramp-up rate(183 ℃ to Peak) +3 ℃ second max Temp. maintain at 125( ±25)℃ 120 seconds max Temp. maintain above 183 ℃ 60-150 seconds Peak temperature range 235 ℃+5-0℃ Time within 5 ℃ of actual Peak Temperature(tp) 10-30 seconds Ramp-down rate +6 ℃/second max High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta=65 ℃±5℃ 3.RH=90%~95% 4.t=1000hrs ±2hrs MIL-STD-202F:103B JIS C 7021: B-11 PART NO. LHR9S53