LHR5230-PF

LHR5230-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : - 200704 - May LHR5230-PF A DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT RECTANGLE TYPE LED LAMPS LHR5230-PF Lead-Free Parts Pb

25.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 100% -60° 60° -30° 30° 2.54TYP + - 1.0MIN LHR5230-PF Package Dimensions PART NO. 7.0 1.5MAX □0.5 TYP 2.0 5.0 1/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Symbol μA Ir Tstg Topr -40 ~ +100 -40 ~ +85 Storage Temperature Operating Temperature Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 Luminous intensity @20mA(mcd) 11038 212.4 Max. Min. Typ. Spectral halfwidth △λnm Peak wave length λPnm 20660 Forward voltage @20mA(V) Min. 1.5 MATERIAL Red GaAlAs Emitted LHR5230-PF PART NO Red Diffused Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Lens COLOR Viewing angle 2θ 1/2 (deg) LHR5230-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 -40-20-020 600650 2.03.04.05.0 4060 0.8 -0-20-404060 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080100 80 2.5 3.0 HR CHIP Page3/5 LHR5230-PFPART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Time(sec)60 Seconds Max Preheat0 50 25° 120° 2°/sec max 100 260° Temp(°C) 260°C3sec Max 5°/sec max 150 Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5LHR5230-PFPART NO.

1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Operating Life Test Thermal Shock Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Low Temperature Storage Test High Temperature Storage Test Reliability Test: Test Item MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5LHR5230-PFPART NO.