LHR3333-H0-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 02 - Apr. - 2006 LHR3333/H0-PF B DATA SHEET SUPER BRIGHT ROUND TYPE LED LAMPS LHR3333/H0-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

25.0MIN □0.5 TYP -60° 60° Directivity Radiation -30° 30° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54TYP 1.0MIN PART NO. LHR3333/H0-PF Page 1/5 1.5MAX 8.67.6 Package Dimensions 5.95.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only + -

Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Storage Temperature Tstg COLOR LHR3333/H0-PF GaAlAs PART NO MATERIAL LensEmitted Water ClearRed PART NO. LHR3333/H0-PF Forward Current IF Operating Temperature Reverse Current @5V Topr Ir Peak Forward Current Duty 1/10@10KHz Power DissipationPD IFP Parameter Symbol ℃-40 ~ +100 Luminous intensity @20mA(mcd) Spectral halfwidth △λnm Peak wave length λPnm Forward voltage @ mA(V) Viewing angle 2θ1/2 (deg) Min. 6601.5 20 Typ.Max. Min. 2.430055038 2/5Page mA30 -40 ~ +85 μA 100 100 mW mA Ratings HR UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 -40-20-020 600650 2.03.04.05.0 4060 0.8 -0-20-404060 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080100 80 2.5 3.0 HR CHIP Page3/5 PART NO. LHR3333/H0-PF

260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) PART NO. LHR3333/H0-PF

MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. Page 5/5PART NO. LHR3333/H0-PF MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Test Condition Reliability Test: Test Item Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only