LHR3130-PF LIGITEK | Alldatasheet
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13 - May. DOC. NO : QW0905- REV. : DATE : - 2009 LHR3130-PF A DATA SHEET ROUND TYPE LED LAMPS LHR3130-PF Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 發行 DCC 立碁電子
25.0MIN -30° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 50% -60° 100%75% Directivity Radiation 60° 50%025%25%100% 75% 30° 1.0MIN2.54TYP + - 1.5MAX □0.5 TYP Package Dimensions PART NO. LHR3130-PF 7.65 4.75 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ IFP PD IF Tstg Topr Symbol Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Reverse Current @5V Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current PART NO. LHR3130-PF 100 -40 ~ +100 -40 ~ +85 Ir10 Ratings HR 100 mW μA mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/5 Viewing angle 2θ 1/2 (deg) Min. 160 Min. 1.5 Forward voltage @ mA(V) Max. 2.4 Peak wave length λPnm 660 Spectral halfwidth △λnm Typ. Luminous intensity @20mA(mcd) 300 Emitted Red PART NO LHR3130-PF MATERIAL GaAlAs Lens COLOR Red Diffused
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 -40-20-020 600650 2.03.04.05.0 4060 0.8 -0-20-404060 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080100 80 2.5 3.0 HR CHIP Page3/5 PART NO. LHR3130-PF
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
0° 0 50Preheat 25° 120° 2°/sec max 100 150 Time(sec) 5°/sec max 260°C3sec Max 260° Temp(°C) LHR3130-PFPART NO. Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LHR3130-PFPART NO. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Item Reliability Test: Test Condition Description Page 5/5 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reference Standard