LHIR4843-A-PF LIGITEK | Alldatasheet

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LHIR4843/A-PFDOC. NO : QW0905- REV. : DATE : - 2016 A 11-Apr. DATA SHEET LHIR4843/A-PF INFRARED EMITTING DIODES LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts 發行 DCC 立碁電子

T-1 3/4 package individually PART NO. infrared emitting diodes encapsulated in water clear plastic TheLHIR4843/A-PF series are high power solution grown efficiency Gallium Arsenide Descriptions: 3. Low average degradation. 2. Suitable for pulsed applications. 1. High radiant intensity. Features: Device Selection Guide: Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. MATERIAL GaAIAs PART NO LHIR4843/A-PF LENS COLOR Water Clear Package Dimensions LHIR4843/A-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/8 1.0 3.8 □0.5 TYP 3.0 2.54TYP 1.0MIN + - 3.8 1.5MAX 25.0MIN

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Optical Characteristics (Aa=25) ℃ PD Power Dissipation 53Le Radiant Intensity Viewing Angle Reverse Current Forward Voltage Spectral Line Half Width Peak Emission Wavelength Aperture Radiant Incidence 2θ1/2 IR VF 1.5 0.7Ee λpeak 1.4 850 Electrostatic Discharge Reverse Voltage Storage Temperature Operating Temperature SYMBOLPARAMETER Min. Typ. Tstg Topr ESD Vr Forward Current Peak Forward Current (300PPS,10μs Pulse) Parameter IFP IF Symbol 100 mW mW/srIF=20mA 100 μA deg VR=5V 1.9 V nm mW/cm nm IF=20mA IF=20mA IF=20mA IF=20mA TEST CONDITIONMax. UNIT -40 ~ +85 -40 ~ +85 2000 V V Ratings HIR A mA UNIT Page2/8LHIR4843/A-PF PART NO. 110

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHIR4843/A-PF Brightness Code For Standard LED Lamps Group HIR CHIP Bin Code PART NO. Radiant Intensity(mW/sr)at 20 mA Min. Max. Page3/8 A4 5 6 A2 3 4 54A3 A1 0 3

Fig.3 Relative Radiant Power vs. Forward DC Current Fig.5 Forward DC Voltage vs. Temperature IFDC[mA] Forward DC Voltage Normalize @20mA, 25 ℃ Ambient Temperature[℃] Relative Radiant Power Normalize @20mA Fig.4 Relative Radiant Power IFPK[mA] Relative Radiant Power Normalize @100 mA Typical Electro-Optical Characteristics Curve Forward Voltage[V] Fig.1 Forward Current vs. Rorward Voltage Forward Current[mA] Wavelength[nm] Fig.2 Relative Radiant Power vs. Wavelength Relative Radiant Power Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only HIR CHIP 0.1 100 1000 0.11 0.1 -40 0.8 -40 0.0 Relative Radiant Power Normalize @ 20mA, 25℃ Ambient Temperature[℃] Fig.6 Relative Radiant Power vs. Temperature vs. Forward Peak Current 1.0 10.0 10100 1001000 1.0 10.0 0.9 1.0 1.1 1.2 -20020406080100-20040 2060100 80 0.5 1.0 1.5 2.0 2.5 3.0 Page4/8 0.5 0.0 800 1.0 850 900 950 LHIR4843/A-PF PART NO.

Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Circuit model A LED Circuit model B LED Page 5/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHIR4843/A-PF PART NO.

  1. The LED lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45°15° Anode side(cathode side on GaAlAs chips) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) (X) Page 6/8LHIR4843/A-PF PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Preheat

60 Seconds Max

00° 25° 120° 2°/sec max 260° Temp(°C) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 100 150 Time(sec) 260°C3sec Max 5°/sec max Page 7/8LHIR4843/A-PF PART NO. Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test Solder Resistance Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. 1.Ta=85℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Test Item Operating Life Test Reliability Test: Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 8/8PageLHIR4843/A-PF PART NO.

1.1000 PCS / BAG

W 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm W H C/NO: MADE IN CHINA ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs L L H