LHIR3331-C1-A-PF LIGITEK | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

LHIR3331/C1/A-PFDOC. NO : QW0905- REV. : DATE : - 2017 A 25 - Apr. DATA SHEET LHIR3331/C1/A-PF INFRARED EMITTING DIODES LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts 發行 DCC 立碁電子

T-1 3/4 package individually PART NO. infrared emitting diodes encapsulated in Blue Transparent clear plastic The LHIR3331/C1/A-PFseries are high power solution grown efficiency Gallium Arsenide Descriptions: 3. Low average degradation. 2. Suitable for pulsed applications. 1. High radiant intensity. Features: Device Selection Guide: Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. MATERIAL GaAIAs/GaAs PART NO LHIR3331/C1/A-PF LENS COLOR Black Package Dimensions LHIR3331/C1/A-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/8 1.5MAX 25.0MIN 2.54TYP □0.5 TYP 1.0MIN 5.9 8.67.6 5.0

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Optical Characteristics (Aa=25) ℃ PD Power Dissipation 75Le Radiant Intensity Viewing Angle Reverse Current Forward Voltage Spectral Line Half Width Peak Emission Wavelength Aperture Radiant Incidence 2θ1/2 IR VF 1.5 3.57Ee λpeak 850 Electrostatic Discharge Reverse Voltage Storage Temperature Operating Temperature SYMBOLPARAMETER Min. Typ. Tstg Topr ESD Vr Forward Current Peak Forward Current (300PPS,10μs Pulse) Parameter IFP IF Symbol 100 mW mW/srIF=100mA 100 μA deg VR=5V 1.9 V nm mW/cm nm IF=100mA IF=100mA IF=100mA IF=100mA TEST CONDITIONMax. UNIT -40 ~ +85 -40 ~ +85 2000 V V 100 Ratings HIR A mA UNIT Page2/8LHIR3331/C1/A-PF PART NO. 125 17.85

3/8Page PART NO. LHIR3331/C1/A-PF Max.Min. 150A22 A21 125 85A19 A20 105 A18 75 180 150 105 125 Radiant Intensity(mW/sr)at 20 mA Brightness Code For Standard LED Lamps Bin Code Group LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Fig.3 Relative Radiant Power vs. Forward DC Current Fig.5 Forward DC Voltage vs. Temperature IFDC[mA] Forward DC Voltage Normalize @20mA, 25 ℃ Ambient Temperature[℃] Relative Radiant Power Normalize @20mA Fig.4 Relative Radiant Power IFPK[mA] Relative Radiant Power Normalize @100 mA Typical Electro-Optical Characteristics Curve Forward Voltage[V] Fig.1 Forward Current vs. Rorward Voltage Forward Current[mA] Wavelength[nm] Fig.2 Relative Radiant Power vs. Wavelength Relative Radiant Power Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only HIR CHIP 0.1 100 1000 0.11 0.1 -40 0.8 -40 0.0 Relative Radiant Power Normalize @ 20mA, 25℃ Ambient Temperature[℃] Fig.6 Relative Radiant Power vs. Temperature vs. Forward Peak Current 1.0 10.0 10100 1001000 1.0 10.0 0.9 1.0 1.1 1.2 -20020406080100-20040 2060100 80 0.5 1.0 1.5 2.0 2.5 3.0 Page4/8 0.5 0.0 800 1.0 850 900 950 LHIR3331/C1/A-PF PART NO.

Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Circuit model A LED Circuit model B LED Page 5/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHIR3331/C1/A-PF PART NO.

Anode side(cathode side on GaAlAs chips) 15° 45° 2. The LED lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) (X) LHIR3331/C1/A-PF PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/8

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

25° 120° Preheat 50 2°/sec max Temp(°C) 260° 100 150 Time(sec) 260°C3sec Max 5°/sec max Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LHIR3331/C1/A-PF PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page7/8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test Solder Resistance Test This test intended to see soldering well performed or not. Reference StandardTest Condition DescriptionTest Item 1.Ta=85℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. PART NO. Reliability Test: LHIR3331/C1/A-PF Page8/8

C/NO: MADE IN CHINA W 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm H ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs L

1.500 PCS / BAG

L 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm W H PACKING SPECIFICATION