LHG35162-S36-PF

LHG35162-S36-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 18 - Mar.-2008 LHG35162/S36-PF A DATA SHEET BIPOLAR TYPE LED LAMPS LHG35162/S36-PF Pb Lead-Free Parts LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions LHG35162/S36-PFPART NO.Page1/6 60°-60° -30° 30° 3.95 1.7 1.76 7.01 10.5±0.3 G2.54TYP H 6.5±0.5 0.5 TYP

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ 1/2 (deg) Min. Min. Forward voltage @ mA(V) Max.Lens Peak wave length λPnm Spectral halfwidth △λnm 0.251.72.690697 Luminous intensity @10mA(mcd) 0.5 Typ.Emitted PART NO MATERIAL Red LHG35162/S36-PF GaP White Diffused COLOR UNIT mA mA μA mW H Ratings 10Ir -40 ~ +85 -40 ~ +100 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Storage Temperature Reverse Current @5V Power Dissipation Symbol Topr Tstg IF PD IFP 100 120 G GreenGaP565301.78.0 4.52.650 PART NO.LHG35162/S36-PF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 3/6PagePART NO.LHG35162/S36-PF

Fig.6 Directive Radiation G CHIP 3.5 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 0.9 0.8 10080 5.04.03.02.0 1.0 0.5 0.0 650600550500 1.2 1.1 1.0 6040200-20-40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 1000 100 1.0 0.1 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Page Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Typical Electro-Optical Characteristics Curve Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Wavelength (nm) Relative Intensity@20mA Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature PART NO.LHG35162/S36-PF

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Page 5/6 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C)

60 Seconds Max

PART NO.LHG35162/S36-PF

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. DescriptionTest Condition 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Operating Life Test High Temperature Storage Test Reliability Test: The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec JIS C 7021: B-12 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test Solderability Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. PART NO.LHG35162/S36-PF