LHG2092-L17-PF

LHG2092-L17-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : - 200621 - Dec. A LHG2092/L17-PF DATA SHEET DUAL COLOR LED LAMPS LHG2092/L17-PF Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions LHG2092/L17-PFPART NO. Page1/6 13.0MIN 1.27TYP 2.0MIN 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED2.0MIN 1.27TYP 1.5MAX □0.5 TYP 5.24.2 2 1 3 1 23 G H 4.0 3.0 75%75%100% 60° 050%25%25%50% -30° 30° 100% 60°

Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Forward Current Parameter Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LHG2092/L17-PF White Diffused GaP Green Red 56530 69790 1.7 2.620 8.0 1.72.63.0 1.2 Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO Spectral halfwidth △λnm Lens MATERIAL COLOR Emitted Peak wave length λPnm Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) Forward voltage @20mA(V) Min.Min.Max. Typ. -40 ~ +100Tstg ℃ 2/6Page Absolute Maximum Ratings at Ta=25 ℃ -40 ~ +85 Ir Topr PD40 IFP 60 μA 100 mW 120 mA Ratings Symbol H IF 15 G 30 mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only GaP LHG2092/L17-PFPART NO.

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 3/6PageLHG2092/L17-PFPART NO.

3.5 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 0.9 0.8 10080 5.04.03.02.0 1.0 0.5 0.0 650600550500 1.2 1.1 1.0 6040200-20-40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 1000 100 1.0 0.1 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Page Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Typical Electro-Optical Characteristics Curve Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Wavelength (nm) Relative Intensity@20mA Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature LHG2092/L17-PFPART NO.

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LHG2092/L17-PFPART NO.

(10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test Operating Life Test Test Item Reliability Test: The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 6/6PageLHG2092/L17-PFPART NO.