LHE3333-S46-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-LHE3333/S46-PF REV. : A DATE : 29 - May. - 2006 DATA SHEET LHE3333/S46-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS Pb Lead-Free Parts

+ - 50%75%100% 60° 30° 25%050% 25% -30° -60° 100% 75% 5.0 5.9 25.0MIN 1.0MIN 8.67.6 □0.5 TYP 2.54TYP 1.5MAX Page 1/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHE3333/S46-PF Package Dimensions Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.

Topr Operating Temperature -40 ~ +85 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Orange MATERIALPART NO LHE3333/S46-PF AlGaInP Storage Temperature Spectral halfwidth △λnm Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) Luminous intensity @20mA(mcd) Dominant wave length λDnm Water Clear Emitted Lens 620172.6 Max. 1.7 Min. 1100 Min. 302200 Typ. -40 ~ +100 COLOR Tstg ℃ Absolute Maximum Ratings at Ta=25 ℃ Electrostatic Discharge( * ) Forward Current Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Parameter Page 2/5 2000 Ratings IF ESD Ir PD IFP Symbol mA30 μA V mA mW HE UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. LHE3333/S46-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 650 HE CHIP 700 3.5 Page3/5 PART NO. LHE3333/S46-PF

5°/sec max

60 Seconds Max

25° 2°/sec max 00° 50 120° 100 Temp(°C) 260° 260°C3sec Max 150 Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 Time(sec) PART NO. LHE3333/S46-PF

(10min) (10min) 2.total 10 cycles 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Operating Life Test Reliability Test: Test Item This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 5/5Page Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHE3333/S46-PF