LHE12243-PF LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : DATE : 09 - Sep.- 2008 DATA SHEET A LHE12243-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHE12243-PF Lead-Free Parts Pb SUPER BRIGHT ROUND TYPE LED LAMPS
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHE12243-PFPART NO. Package Dimensions 1/5Page 25.0MIN 1.0MIN 2.54TYP □0.5 TYP 5.3 4.0 1.5MAX 1.0 3.0 30° -30° 60° 50%75%100% -60° 25%25% 075%100%50%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) 2022004000 Typ.Min. Spectral halfwidth △λnm Peak wave length λDnm 2.61.717620 LensMin. PART NOMATERIAL OrangeAlGaInPLHE12243-PF Emitted Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. COLOR Forward voltage @ mA(V) Max. Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ PART NO. LHE12243-PF Topr Operating Temperature -40 ~ +85 Storage Temperature -40 ~ +100Tstg ℃ Electrostatic Discharge( * ) Forward Current Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Parameter 2000 Ratings IF ESD Ir PD IFP Symbol mA μA V mA mW UNIT Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Water Clear
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 650 HE CHIP 700 3.5 Page3/5PART NO. LHE12243-PF
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHE12243-PF 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 5°/sec max Temp(°C) 260° 260°C3sec Max 100 150 Time(sec) 2°/sec max25° 00°
60 Seconds Max
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test High Temperature High Humidity Test Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
Description
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Operating Life Test Test ConditionTest Item MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Page 5/5PART NO. LHE12243-PF