LH55140-PF LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb RECTANGLE TYPE LED LAMPS LH55140-PF DATA SHEET LH55140-PF A 25 - Dec. - 2006 DOC. NO : QW0905- REV. : DATE :
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 4.0 2.0 LH55140-PF Package Dimensions PART NO. 1.5 MAX + - 2.54TYP 1.0MIN 30° 60° 75%100%25%25%0 50% Directivity Radiation -30° -60° 50%75%100% Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN □0.5 TYP
℃Topr -40 ~ +85 Operating Temperature Typical Electrical & Optical Characteristics (Ta=25 ℃) Max. Forward voltage @20mA(V) 2.6 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Red Emitted LH55140-PF GaP PART NO MATERIAL Red Diffused 6971.7 COLOR Lens Peak wave length λPnm Min. Storage Temperature Tstg -40 ~ +100 1.50.8 108 Viewing angle 2θ 1/2 (deg) Luminous intensity @ mA(mcd) Typ. Min. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Power Dissipation Forward Current Parameter Ir PD IFP IF Symbol Absolute Maximum Ratings at Ta=25 ℃ μA10 40 mW 60 mA mA H UNIT Page 2/5 Spectral halfwidth Δλnm PART NO. LH55140-PF
Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 3/5PagePART NO. LH55140-PF
60 Seconds Max
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 0° 0 25° 120° Preheat 50 100 2°/sec max Temp(°C) 260° 260°C3sec Max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5PART NO. LH55140-PF
MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Test Condition Operating Life Test Reliability Test: 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
Description
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs PART NO. LH55140-PF