LH52640-PF LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV : DATE : - 2008 LH52640-PF A DATA SHEET ROUND TYPE LED LAMPS LH52640-PF Pb Lead-Free Parts LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 06 - May.
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation PART NO. LH52640-PF Package Dimensions Page 1/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 30° 100%50%75%025% 25% 60° 75%100% -60° -30° 50% + - 2.54TYP 2.9 3.8 4.58 5.38 1.5MAX □0.5 TYP 25.0MIN 1.0MIN
-40 ~ +100Tstg Storage Temperature Forward voltage @20mA(V) Luminous intensity @10mA(mcd) Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) MATERIALPART NO Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaPLH52640-PF4.5 Typ. RedRed Diffused 3.02.61.790 EmittedLensMin.Max.Min. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR Page 2/5 Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Forward Current Power Dissipation Parameter 20 mAIF Topr Ir -40 ~ +85 PD IFP μA mA mW Symbol H Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LH52640-PF Peak wave length λPnm 697
1.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) 1000900800700600 Wavelength (nm) Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA 0.0 0.5 1.0 0.8 -40 0.9 -20020406080100-40 0.0 1.0 0.5 -20 804020060100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.1 1.0 1.2 Forward Current(mA) 0.1 1.0 1.0 100 1000 2.03.0 2.0 3.0 2.5 Relative Intensity Normalize @20mA 4.05.01.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage H CHIP 101001000 Page3/5 PART NO. LH52640-PF
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 500° 0 Preheat 25° 120° 2°/sec max 150100 Time(sec) 260°C3sec Max 5°/sec max 260° Temp(°C) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5
60 Seconds Max
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO. LH52640-PF
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test High Temperature High Humidity Test Solder Resistance Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ConditionTest Item Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Page 5/5PART NO. LH52640-PF