LH4630-PF LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : DATE : DATA SHEET LH4630-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LH4630-PF 21 - Jul. - 2006 A CYLINDRICAL TYPE LED LAMPS
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LH4630-PF Page 1/5 8.8 9.8 25.0MIN 1.5MAX □0.5 TYP 5.0 5.6 1.0MIN 2.54TYP + - 30°-30° 60° 100% -60°
℃Topr -40 ~ +85 Operating Temperature Typical Electrical & Optical Characteristics (Ta=25 ℃) Max. Forward voltage @20mA(V) 2.6 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Red Emitted LH4630-PF GaP PART NO MATERIAL Red Diffused 6971.7 COLOR Lens Peak wave length λPnm Min. Storage Temperature Tstg -40 ~ +100 1.50.8144 Viewing angle 2θ 1/2 (deg) Luminous intensity @ mA(mcd) Typ. Min. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Power Dissipation Forward Current Parameter Ir PD IFP IF Symbol Absolute Maximum Ratings at Ta=25 ℃ μA10 40 mW 60 mA mA H UNIT Page 2/5 Spectral halfwidth Δλnm LH4630-PFPART NO.
Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 3/5PageLH4630-PFPART NO.
60 Seconds Max
2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150100 260° Temp(°C) 2°/sec max 120° 0° 0 25° Preheat 260°C3sec Max 5°/sec max LH4630-PFPART NO.
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 DescriptionTest Condition Reliability Test: Test Item 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test Operating Life Test High Temperature Storage Test Low Temperature Storage Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LH4630-PFPART NO.