LH3330-PF-TRF-X

LH3330-PF-TRF-X LIGITEK | Alldatasheet

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TAPE AND REEL TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DOC. NO : QW0905-LH3330-PF/TRF-X REV. : A DATE : 09 - Nov. - 2007

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1/7Page F - + W3W1 Package Dimensions L W0 LH3330-PF/TRF-XPART NO. H T 7.6 8.6 5.0 5.9 + - 1.0MIN 2.54TYP 25.0MIN LH3330-PF Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. □0.5 TYP 1.5MAX P D

Δλnm LH3330-PF/TRF-X 2/7Page UNIT H mA mA60 mW40 10 μA PART NO. Absolute Maximum Ratings at Ta=25 ℃ Symbol IF IFP PD Ir Parameter Forward Current Power Dissipation Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Min. Typ. Luminous intensity @ mA(mcd) Viewing angle 2θ 1/2 (deg) 283.04.5 -40 ~ +100Tstg Storage Temperature Min. Peak wave length λPnm Lens COLOR

1.7697 Red Diffused

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 Forward voltage @20mA(V) Max. Typical Electrical & Optical Characteristics (Ta=25 ℃) Operating Temperature -40 ~ +85Topr ℃

PART NO. LH3330-PF/TRF-X 0.17 0.08 0.23 0.77 0.96 0.83 0.89 0.83 0.83 1.04 0.65 1.1 0.91 1.02 0.43 0.18 0.51 1.42 0.06 0.61 0.38 0.75 0.16 0.3 0.89 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Minimum SPECIFICATIONS OPTION CODE SYMBOL 4.23.80.15 5.84.80.19 F mmmm inch Front-To-Rear Deflection Component Lead Pitch Dimensions Symbol Information• Tape Feed Hole Diameter SYMBOL ITEMS 19.517.50.69 24.522.50.89 21.019.00.75 TRF-1 TRF-3 TRF-2 22.521.50.85 21.12517.1250.67 21.220.20.8 TRF-5 TRF-7 H1TRF-6 26.525.51.0TRF-4 Feed Hole To Bottom Of Component 16.515.5H0.61Height Of Seating Plane 28.026.01.02 23.021.00.83 26.024.00.94 TRF-9 TRF-12 TRF-11 11.0W0 4.553.150.12 13.012.40.49 Lead Location Feed Hole Pitch Feed Hole To Overall Component Height Lead Length After Component Height 15.514.50.57 9.758.50.33 19.017.50.69 Package Dimensions• Adhesive Tape Width Feed Hole Location Tape Width Adhesive Tape Position Overall Taped Package Thickness Dimensions Symbol Information• REMARK:TRF=Tape And Reel Forming Leads MARKINGmminchmm Symbol minimum 3803.08 1021.37 78.2D 34.9D1 14.96 inch maxmum 4.02 88.01.13 38.10.54 28.6D2 13.8D3 57.2--- 50.01.18 ---T 30.0T1 3.46 2.25 1.5 1.97 D

Description

Hub Recess Inside Diameter Iside Reel Flange Thickness 1000PCSLH3330-PF/TRF-X Specification 22.520.00.79TRF-8 Page 3/7 inch Maximum D1D2

PART NO. LH3330-PF/TRF-X Page 4/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Minimum SPECIFICATIONS Maximum 0.17 0.08 0.23 0.154.23.8 0.194.85.8 inchinchmm mm OPTION CODE Dimensions Symbol Information• SYMBOL ITEMS Component Lead Pitch Tape Feed Hole Diameter Front-To-Rear Deflection △H D F SYMBOL 0.79 0.93 0.93 0.75 20.019.0 0.89 23.522.5 0.8521.723.7 0.77 1.08 0.85 0.73 19.518.5 1.027.525.5 20.5 0.8121.5 17.518.0 0.69 0.71 TRF-13 TRF-15 TRF-14 TRF-17 TRF-19 TRF-18Feed Hole To Bottom Of Component TRF-16 0.650.6115.5 16.5Height Of Seating Plane H 1.06 0.91 0.9827.025.0 0.8722.023.0 0.43 0.18 0.51 11.0W0L 0.124.553.15 0.4912.413.0 TRF-21 TRF-22 Lead Location Feed Hole Pitch Lead Length After Component Height P 0.06 0.61 0.38 0.5715.514.5 0.338.59.75 0.750.6919.017.5 Package Dimensions• 0.16004.0 Adhesive Tape Width Feed Hole Location Overall Taped Package Thickness REMARK:TRF=Tape And Reel Forming Leads Dimensions Symbol Information• inch 14.96 4.02 MARKING D2 D1 3.46 1.5 2.25 1.97 T2T1 D mminch Symbol mm minimum 3803.08 1021.37 D 78.2 34.9 88.01.13 38.10.54 28.6 13.8 57.2--- 50.01.18 T --- 30.0 Arbor Hole Diameter Hub Recess Inside Diameter Overall Reel Thickness Iside Reel Flange Thickness maxmum 1000PCSLH3330-PF/TRF-X Specification 0.890.8120.522.5TRF-20

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 5/7PART NO. PageLH3330-PF/TRF-X Fig.6 Directivity Radiation

2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 150 Time(sec) 260°C3sec Max 260° Temp(°C) 2°/sec max 10050Preheat 120° 25° 00° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

PART NO.LH3330-PF/TRF-X

This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Description Page7/7 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard PART NO.LH3330-PF/TRF-X