LH32740

LH32740 LIGITEK | Alldatasheet

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A - 200404 - Nov LH32740 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LH32740 TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 ROUND TYPE LED LAMPS DATA SHEET DOC. NO : QW0905- REV. : DATE :

1/4PageLH32740PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 25.0MIN 1.0MIN 4.85 3.1 3.8 □0.5 TYP 2.5TYP + - 1.5MAX 3.55 25%75%100% 50% -60° -30° 75%25%0 50% 100% 30° 60°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ 1/2 (deg) Min. Min. Forward voltage @ mA(V) Max.Lens Peak wave length λPnm Spectral halfwidth △λnm 1.21.7 2.690697 Luminous intensity @10mA(mcd) 1.8 Typ.Emitted PART NO MATERIAL RedLH32740 GaP Red Diffused COLOR UNIT mA mA μA mW H Ratings 10Ir -40 ~ +85 Max 260℃ for 5 sec Max (2mm from body) -40 ~ +100 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Soldering Temperature Storage Temperature Reverse Current @5V Power Dissipation Symbol Tsol Topr Tstg IF PD IFP LH32740

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700 800 900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200- 4 0 100 0.0 80600 20 40 100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA)0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 10 100 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 PART NO. Page3/4LH32740

PART NO. Page 4/4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) Operating Life Test This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hous. This test intended to see soldering well performed or not. LH32740