LH2043-S108-PF

LH2043-S108-PF LIGITEK | Alldatasheet

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LH2043/S108-PFDOC. NO : QW0905- REV. : DATE : 20 - Oct. - 2009 A DATA SHEET LH2043/S108-PF ROUND TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Directivity Radiation Package Dimensions PART NO. LH2043/S108-PF Page 1/5 60°-60° 75%100% 50% 25% 0 25% 75%50% 100% -30° 30° 4.03.0 4.5±0.55.2 6.8±0.3 4.2

-40 ~ +100Tstg Storage Temperature Forward voltage @20mA(V) Luminous intensity @10mA(mcd) Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) MATERIAL Peak wave length λPnm PART NO Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaP 8.0 Typ. 697Red Water Clear 4.5 2.61.790 E m i t t e d L e n s M i n .M a x .M i n . Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR Page 2/5 PART NO. Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Forward Current Power Dissipation Parameter 20 mAIF Topr Ir -40 ~ +85 PD IFP μA mA mW Symbol H Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LH2043/S108-PF LH2043/S108-PF

1.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) 1000900800700600 Wavelength (nm) Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA 0.0 0.5 1.0 0.8 -40 0.9 -20 0 20 40 60 80 100 -40 0.0 1.0 0.5 -20 80402006 0 1 0 0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.1 1.0 1.2 Forward Current(mA)0.1 1.0 1.0 100 1000 2.0 3.0 2.0 3.0 2.5 Relative Intensity Normalize @20mA 4.0 5.0 1.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage H CHIP 10 100 1000 Page3/5 LH2043/S108-PF PART NO.

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Preheat

60 Seconds Max

0°0 25° 2°/sec max 100 120° 260° Temp(°C) 5°/sec max 260°C3sec Max 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5LH2043/S108-PF PART NO.

1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test High Temperature High Humidity Test (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 Page 5/5 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Low Temperature Storage Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) Reliability Test: Test Item Test Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LH2043/S108-PF PART NO.