LH2020-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET ROUND TYPE LED LAMPS LH2020-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LH2020-PF 05 - Mar. - 2006 A Lead-Free Parts Pb

100%75% 50% -60° -30° 100%25%025%75% 50% 60° 30° 1/5PageLH2020-PFPART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 4.0 □0.5 TYP 12.5MIN 2.3TYP 1.0MIN 1.5 MAX 5.24.2 3.0 + -

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ IFP PD IF Tstg Topr Symbol Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Reverse Current @5V Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current -40 ~ +100 -40 ~ +85 Ir10 Ratings H mW μA mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/5 Viewing angle 2θ1/2 (deg) Min. 1.2 Min. 1.7 Forward voltage @ mA(V) Max. 2.6 Peak wave length λPnm 697 Spectral halfwidth △λnm Typ. Luminous intensity @10mA(mcd) 1.8 Emitted Red PART NO LH2020-PF MATERIAL GaP Lens COLOR Red Diffused LH2020-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 Fig.2 Relative Intensity vs. Forward Current 100010010 Forward Current(mA) 2.5 2.0 0.5 1.0 1.5 0.0 Forward Voltage(V) Relative Intensity Normalize @20mA H CHIP 1000 1.0 1.0 0.1 Forward Current(mA) 100 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 3.0 2.0 1.0 1.5 2.5 Fig.4 Relative Intensity vs. Temperature 100402006080 0.0 100-40020406080 Ambient Temperature(℃) -20 Relative Intensity@20mA Normalize @25℃ 0.5 1.2 1.1 0.9 1.0 0.8 -40-20 1.0 Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) 900800700 Wavelength (nm) 0.5 0.0 600 Relative Intensity@20mA Page 3/5 LH2020-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0

60 Seconds Max

LH2020-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LH2020-PFPART NO.