LH12340-PF

LH12340-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only - 200813 - May. LH12340-PF A Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 25%75%100%50% -60° -30° 0 75%25%50%100% 30° 60° + - 25.0MIN □0.5 TYP 1.0MIN2.54TYP 1.5MAX 4.13.3 PART NO. LH12340-PF 3.8 3.0 Page 1/5

-40 ~ +100Tstg Storage Temperature Forward voltage @20mA(V) Luminous intensity @10mA(mcd) Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) MATERIALPART NO Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaPLH12340-PF 3.0 Typ. Red Red Diffused 1.82.61.790 EmittedLensMin.Max.Min. 112 Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR Page2/5 Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Forward Current Power Dissipation Parameter 20 mAIF Topr Ir -40 ~ +85 PD IFP μA mA mW Symbol H Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Peak wave length λPnm 697 PART NO. LH12340-PF

1.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) 1000900800700600 Wavelength (nm) Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA 0.0 0.5 1.0 0.8 -40 0.9 -20020406080100-40 0.0 1.0 0.5 -20 804020060100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.1 1.0 1.2 Forward Current(mA) 0.1 1.0 1.0 100 1000 2.03.0 2.0 3.0 2.5 Relative Intensity Normalize @20mA 4.05.01.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage H CHIP 101001000 Page3/5 LH12340-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 2°/sec max 120° 00° Preheat 25° 260° Temp(°C) 50 100 5°/sec max 260°C3sec Max 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) Page 4/5 PART NO.

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test Low Temperature Storage Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Test Item Reliability Test: This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition Description MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard PART NO. LH12340-PF 5/5Page