LFURF3360-PF LIGITEK | Alldatasheet
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Technical content
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFURF3360-PF DOC. NO : QW0905-LFURF3360-PF REV : A DATE : 24 - Jun. - 2011 DATA SHEET FLASH ROUND TYPE LED LAMPS 發行 DCC 立碁電子
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFURF3360-PF Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN □0.5 TYP 2.54TYP 1.0MIN 1 2 1.5 MAX 7.6 8.6 5.0 5.9
Features
Built-in IC chip flashes lamps• on and off to attract attention Pulse rate 2.4Hz• T-1 3/4size• 1 inch leads• Large full flood radiating area• IC compatible•
Description
The LFURF3360-PF series is a solid state lamp with a red diffused plastic lens The built-in IC flashes the lamp on/off and can be driven directly by standard TTL and CMOS circuit eliminating the need for external switching circuitry
2.03.0RedAlGaInPLFURF3360-PF Red Diffused COLOR Lens MATERIALPART NO Emitted 220 Typ. Spectral halfwidth △λnm 630 Dominant wave length λDnm Max.Min. 120 Min. 3.0 Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO. LFURF3360-PF Min.Max. Operating voltage pulse rate(Hz) volt=5v luminous intensity volt=5v(mcd) V mA UNIT Storage Temperature Operating Temperature Tstg Topr -20 ~ +85 -0 ~ +85 Symbol Reverse Voltage Vr Parameter 0.4 Ratings URF Peak Forward Current (1/4)Duty cycle Operating Voltage V 10Vopr IFP
Relative Intensity@20mA Normalize@25℃ Forward Voltage@20mA Normalize @25℃ 0.9 Wavelength (nm) 1.0 Relative Intensity@20mA 550 0.5 650600 700 Fig.5 Relative Intensity vs. Wavelength -40 0.8 Ambient Temperature(℃) 40-0-202080 60100 Ambient Temperature(℃) -0-40-20 0.5 602040100 80 2.5100 Relative Intensity Normalize @20mA Forward Current(mA) Fig.3 Forward Voltage vs. Temperature 1.0 1.1 1.2 1.0 0.1 1.0 Forward Voltage(V) 1.52.02.53.0 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 0.5 Forward Current(mA) 1.0 10100 1.5 1.0 2.0 1000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 1000 URF CHIP Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 Page3/5 PART NO. LFURF3360-PF
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 5°/sec max Temp(°C) 260° 260°C3sec Max 150100 Time(sec) 2°/sec max25° 00° Preheat Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) PART NO. LFURF3360-PF
MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Operating Life Test Test Condition Reliability Test: High Temperature Storage Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. PART NO. LFURF3360-PF