LFPAK56-SINGLE AMKOR | Alldatasheet
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Technical content
DATA SHEET | POWER PRODUCTS
Applications
LFPAK56–SINGLE is suitable for medium-power applications (over 100A available), designed for low on-resistance and high-speed switching MOSFETs. f Motor drivers f Power supply circuits f DC-DC converters f Key applications for automotive in body, safety and lighting Reliability Qualification Amkor packages are assembled with proven reliable semiconductor materials. All reliability testing includes: f JEDEC standard pre-conditioning except for high temperature storage f 85°C/85% RH, 168 hours, IR reflow 260°C 3X f H3TRB: 85°C/85% RH, 1000 hours f uHAST: 130°C/85% RH, 96 hours f Temperature cycle: -55°C to 150°C, 1000 cycles f High temp storage: 150°C, 1000 hours Test Services Amkor offers full turnkey business for all power discrete products with the capability to test various types of power devices including MOSFETs, intelligent power devices, etc. f Power discrete test capability ▷ DC ▷ Capacitance *1 ▷ Rg *1 ▷ Avalanche test ▷ Thermal resistance f Program conversion f Electrical failure analysis f Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only LFPAK56–SINGLE follows the JEDEC standard (MO-235) for medium- power discrete products. LFPAK56–SINGLE
Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2020 Amkor Technology, Incorporated. All Rights Reserved. DS415C-EN Rev Date: 01/20 LFPAK56–SINGLE Standard Materials f Frame: Bare copper f Die attach: Pb solder f Interconnect: Copper beam lead f Mold compound: Halogen-free Shipping f Tape and reel packing ▷ 3000 pcs per reel ▷ Tape width: 12 mm ▷ Reel Ф = 330 mm f Barcode packing label Cross Section Package Outline Drawing Mold compound Die Frame A B Die attach material Copper beam lead C D E B C A D E