LFDGM2063-1.5HZ LIGITEK | Alldatasheet
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Technical content
DOC. NO : QW0905-LFDGM2063-1.5HZ REV. : A DATE : 28 - Oct.- 2014 DATA SHEET FLASH ROUND TYPE LED LAMPS LFDGM2063-1.5HZ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts 發行 DCC 立碁電子
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PART NO. LFDGM2063-1.5HZ Package Dimensions Page 1/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
Features
Built-in IC chip flashes lamps• on and off to attract attention Pulse rate 1.5Hz• 3mm size• 1 inch leads• Large full flood radiating area• IC compatible•
Description
The LFDGM2063-1.5HZ series is a solid state lamp with a water clear plastic lens The built-in IC flashes the lamp on/off and can be driven directly by standard TTL and CMOS circuit eliminating the need for external switching circuitry 25.0MIN 1.0MIN 2.54TYP □0.5 TYP 3.0 4.0 5.24.2 1.5MAX
Topr Operating Temperature -0 ~ +60 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Green MATERIALPART NO LFDGM2063-1.5HZ InGaN Storage Temperature Spectral halfwidth △λnm Pulse rate(Hz) volt=5v Operating Voltage Luminous intensity volt=5v(mcd) Dominant wave length λDnm Emitted Lens 525361.8 Max. 1.2 Min. Min. 4.890 Typ. -20 ~ +100 COLOR Tstg ℃ Absolute Maximum Ratings at Ta=25 ℃ Reverse Voltage Parameter Page 2/5 Ratings Vr Symbol 0.4 V UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFDGM2063-1.5HZ Operating Voltage Vopr 4.8 V Water Clear Max. 3.0 Min. 2.0 Typ.Typ. 1.5
Fig.3 Forward Voltage vs. Temperature Ambient Temperature(℃) Forward Voltage@20mA Normaliz @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity @20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DGM CHIP Wavelength (nm) Relative Intensity @20mA Fig.5 Relative Intensity vs. Wavelength Page 3/5 PART NO. LFDGM2063-1.5HZ 5.04.03.02.0 1000 100 1.0 0.1 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 0.9 0.8 10080 1.2 1.1 1.0 6040200-20-40 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 500 1.0 0.5 0.0 600550450
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
0° 0 25° 120° 50 100 150Preheat Time(sec) 2°/sec max 260° Temp(°C) 260°C3sec Max 5°/sec max PART NO. LFDGM2063-1.5HZ Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=245℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles Solder Resistance Test Thermal Shock Test 1.T.Sol=260℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. PART NO. LFDGM2063-1.5HZ 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Operating Life Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Page 5/5 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Description Reference Standard