LFD4H5-62-XX-SRP61-1-PF

LFD4H5-62-XX-SRP61-1-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY(0.39Inch) Lead-Free Parts Pb DOC. NO : QW0905-LFD4H5/62-XX/SRP61-1-PF REV. : B DATE : 22 - Nov. - 2005

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LFD4H5/62-XX/SRP61-1-PF Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1/8Page E F C DPD G B A 6.1±0.5 PIN 10PIN 6PIN 5PIN 1 10.16 2.54*4 =10.16 ψ0.45TYP 2.54*4 =10.16 DIG.2 39.2(1.543") 10.16 (0.4") DIG.1 DIG.4DIG.3 DP2 DP1 6.4 (0.252") ψ1.4 (0.055") 12.9 (0.508") 10.28 (0.405") LFD4H5/62-XX/SRP61-1-PF LIGITEK PIN NO.1 4.5 2.5±0.5

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. Page2/8LFD4H5/62-XX/SRP61-1-PF LFD4H62-XX/SRP61-1-PF LFD4H52-XX/SRP61-1-PF DP2 D FE 813149121126 A BED FABEF DP1 DIG.4 DIG.3 G C G C G 18191416173 BAFEBDA DIG.2 DIG.1 CCG D D GC C DIG.1 DIG.2 ADB EF A B 317 164 1 1918 GCGCG DIG.3 DIG.4 DP1FE BA FDE BA 6211 12 9 14138 EFD DP2

PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/8PageLFD4H5/62-XX/SRP61-1-PF 5 Common Cathode Dig.2 Anode D (Dig.3,Dig.4) AnodeE (Dig.3,Dig.4) AnodeC (Dig.3,Dig.4) AnodeA (Dig.3,Dig.4) AnodeB (Dig.3,Dig.4) AnodeF (Dig.3,Dig.4) AnodeG (Dig.3,Dig.4) AnodeB (Dig.1,Dig.2) AnodeG (Dig.1,Dig.2) AnodeF (Dig.1,Dig.2) AnodeA (Dig.1,Dig.2) Anode DP2 Common Cathode Dig.4 Common Cathode Dig.3 Common Cathode Dig.1 Cathode G (Dig.3,Dig.4) Cathode G (Dig.1,Dig.2) Cathode F (Dig.1,Dig.2) Cathode A (Dig.1,Dig.2) Cathode B (Dig.1,Dig.2) Common Anode Dig.3 Common Anode Dig.120 Cathode F (Dig.3,Dig.4) Cathode A (Dig.3,Dig.4) Cathode B (Dig.3,Dig.4) Cathode C (Dig.3,Dig.4) Cathode E (Dig.3,Dig.4) Cathode D (Dig.3,Dig.4) Cathode DP2 Common Anode Dig.4 AnodeC (Dig.1,Dig.2) AnodeE (Dig.1,Dig.2) Anode 1 AnodeD (Dig.1,Dig.2)1 PIN NO Cathode C (Dig.1,Dig.2) Cathode E (Dig.1,Dig.2) Cathode D (Dig.1,Dig.2) Cathode DP1 Common Anode Dig.2 LFD4H52-XX/SRP61-1-PFPIN NOLFD4H62-XX/SRP61-1-PF

Max. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ LFD4H62-XX/SRP61-1-PF LFD4H52-XX/SRP61-1-PF PART NO Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Operating Temperature Storage Temperature (nm) common cathode or anode λP (nm) Common Anode Common Cathode GaP Material Green Emitted 56530 Typ. 1.7 Min. 2.12.6 Topr Tstg CHIP Vf(v) -25 ~ +85 -25 ~ +85 3.05 Typ. 1.75 Min. 2:1 Iv(mcd) IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Symbol IF PD Ir IFP Parameter 100 120 Ratings G 4/8Page mW μA mA mA UNIT LFD4H5/62-XX/SRP61-1-PF

Luminous Intensity Matching Ratio IV-M Test Condition For Each Parameter PART NO. Forward Voltage Per Chip Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Parameter 5/8Page Vf volt Ir Iv λp μA nm mcd nm Symbol Unit If=20mA Vr=5V If=20mA If=10mA If=20mA Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Peak Wavelength LFD4H5/62-XX/SRP61-1-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity @20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 6/8LFD4H5/62-XX/SRP61-1-PF

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Page 7/8LFD4H5/62-XX/SRP61-1-PF

MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 PART NO. Operating Life Test Reliability Test: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Test Item This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.

Description

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LFD4H5/62-XX/SRP61-1-PF