LFD4C5-62-XX-PF LIGITEK | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
DOC. NO : QW0905- REV. : C DATE : - 2006 LFD4C5/62-XX-PF 13 - Jul. LFD4C5/62-XX-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.4 Inch) Pb Lead-Free Parts
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PART NO. Package Dimensions LFD4C5/62-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/8 D F E DP BG A C DP4 ψ1.4(0.055") 4.7±0.5 39.2(1.543") PIN NO.1 2.54X6=15.24 (0.6") LFD4C5/62-XX-PF LIGITEK DP1 10.16 (0.4") DIG.1 DP3DP2 DIG.3DIG.2 DP5 DIG.4 10.28 (0.405") 6.4(0.252") 12.9 (0.508") Ø 0.45 TYP
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO.2/8 PageLFD4C5/62-XX-PF LFD4C52-XX-PF LFD4C62-XX-PF C F G E D 6 DIG. 4 A B C F G E D 8 DIG. 3 A B DP5 DP2 C F G D E A B DIG. 4 C F G D E A B DP2 DP5 DIG. 3 G E 9 F G C D DIG. 2 A B 7 E F C D DIG. 1 A B G E F G C D A B DIG. 2 E F C D 12 A B DIG. 1 PIN 14 :Nc
Common Anode Dig.3 Common Anode Dig.4 Common Cathode Dig.3 Anode B Common Cathode Dig.4 Cathode B PIN NO.1 PART NO. Electrical Connection LFD4C62-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD4C52-XX-PFPIN NO.1 Page3/8 Common Cathode Dig.2 Common Anode Dig.2 Anode DP2 Cathode DP2 Common Cathode Dig.1 Common Anode Dig.1 Anode G Cathode G Anode C Cathode C Anode D Cathode D Anode E Cathode E Anode F Cathode F Anode A Cathode A
13 Anode DP5 Cathode DP5 13
14 Nc 14 Nc
Iv(mcd) Typ. 2.35 Operating Temperature Storage Temperature PART NO LFD4C52-XX-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ common cathode or anode λP (nm) (nm)
565 Green
30 1.7 Min. 2.6 Max. 2.1 Typ. 1.35 Min. CHIP Tstg Topr Electrical Vf(v) -25 ~ +85 -25 ~ +85 2:1 IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ PART NO. PD Ir IF IFP Symbol 100 120 Ratings G 4/8Page μA mW mA mA UNIT LFD4C62-XX-PF LFD4C5/62-XX-PF
Luminous Intensity Matching Ratio IV-M Test Condition For Each Parameter PART NO. Forward Voltage Per Chip Luminous Intensity Per Chip Spectral Line Half-Width Peak Wavelength Reverse Current Any Chip Parameter Page5/8 Vf volt Ir Iv λP nm μA nm mcd Symbol Unit If=20mA If=20mA Vr=5V If=10mA If=20mA Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD4C5/62-XX-PF
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 6/8LFD4C5/62-XX-PF
60 Seconds Max
0 Preheat
25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Page 7/8LFD4C5/62-XX-PF
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. PART NO. Test Item Operating Life Test High Temperature Storage Test Low Temperature Storage Test Reliability Test: Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.