LFD435-69-XX-D1

LFD435-69-XX-D1 LIGITEK | Alldatasheet

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LFD435/69-XX/D1DOC. NO : QW0905- REV. : A DATE : - 200404 - Nov LFD435/69-XX/D1 DATA SHEET TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 FOUR DIGIT LED DISPLAY (0.39 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. F LFD435/69-XX/D1 PART NO. Package Dimensions E Page 1/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DPD BG C A DIG.4 40.18(1.582") 3.0±0.5 2.54X7=17.78(0.7") PIN NO.1 LFD435/69-XX/D1 LIGITEK DP 10.0 (0.39") DIG.1 DIG.3L1DIG.2 7.0(0.276") 12.8 (0.504") 10.16 (0.4")

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. LFD4369-XX/D1 2/7Page B16 G DP F E B D C A DIG. 4 D DP G F E 6 B C A DIG. 3 C DP E F G D G A B DP DIG. 2 E F C D 14 A DIG. 1 DIG. 2B D DP G E F DIG. 4 C B A F G DP E D DIG. 3 A C B G DP D F E C A F A DP G DIG. 1 D E 1 C B LFD4359-XX/D1 LFD435/69-XX/D1

2 Common Cathode Dig.2 Anode C,L3 NO PIN Anode A,L1 Anode G Anode D NC NO PIN Anode F Anode DP Common Cathode Dig.4 Anode E Common Cathode Dig.3 Common Cathode L1,L2,L3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Dig.1 Electrical Connection PART NO. PIN NO.1 LFD4359-XX/D1 3/7Page

16 Anode B,L2

Common Anode L1,L2,L3 Common Anode Dig.1 Common Anode Dig.3 Common Anode Dig.4 Common Anode Dig.2 Cathode B,L2 Cathode G Cahtode F Cathode A,L1 NO PIN Cathode C,L3 Cathode DP NO PIN NC Cathode E Cahtode D PIN NO.1 LFD435/69-XX/D1

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25 )℃ LFD4359-XX/D1 AlGaInP PART NO Electrical Common Anode 605 Orange 2.62.117 1.7 λD (nm) common cathode or anodeEmitted Vf(v) Max.Typ. (nm) Min. 2:13726 Typ. IV-M Min. Iv(mcd) Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Forward Current Per Chip Power Dissipation Per Chip Operating Temperature Storage Temperature Reverse Current Per Any Chip Electrostatic Discharge Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ PART NO. Parameter 30IF mA 2000ESD Tstg Topr -25 ~ +85 -25 ~ +85 PD IFP Ir μA mW mA μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings 9SEF 4/7Page UNIT LFD4369-XX/D1 Common Cathode LFD435/69-XX/D1

Luminous Intensity Matching Ratio Parameter Luminous Intensity Per Chip Dominant Wavelength Forward Voltage Per Chip Ir μA nm Vr=5V If=20mA Iv λD Vf mcd nm volt Unit If=10mA If=20mA If=20mA Test Condition Test Condition For Each Parameter PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7LFD435/69-XX/D1

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature( ℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature( ℃) Relative Intensity@20mA Normalize @25℃ Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 40200 80 100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 Typical Electro-Optical Characteristics Curve 9SEF CHIP Page PART NO. 6/7LFD435/69-XX/D1

The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=105 (10min) (10min) 2.total 10 cycles MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solderability Test Solder Resistance Test This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this test is the resistance of the device under tropical for hous. Reliability Test: High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) Test Condition This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.

Description

PART NO. MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Page 7/7LFD435/69-XX/D1