LFD415-62-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 2009 LFD415/62-XX-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY(0.39Inch) LFD415/62-XX-PF 19 - May. Lead-Free Parts Pb 發行 DCC 立碁電子

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO.1 LFD415/62-XX-PF LIGITEK DP D E F C DP G B A DIG.3DIG.1DIG.2 DP1 DP2 DP3 DIG.4 40.18(1.582") 10.0 (0.39") 2.54X7=17.78 (0.7") 12.8 (0.504") 10.16 (0.4") 7.0(0.276") LFD415/62-XX-PF Page1/8 Ø 0.45 TYP PIN1 PIN8 PIN9PIN16 3.0〜3.5

LFD415/62-XX-PF PART NO. LFD4162-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD4152-XX-PF Internal Circuit Diagram AA 14 C D G DP E F DP DIG. 4B C DP3 A F G E D C DP DIG. 3 DP2 B A DP1 G F E D F DIG. 2 A B G DP 7 DIG. 1 C D E 1 B C D G DP E F DP DIG. 4B C DP3 A F G D E 6 C DP DIG. 3 DP2 B A DP1 F G E D F DIG. 2 A B G DP DIG. 1 D E 1 B C Page2/8

  1. Common Anode Dig.2. Common Cathode Dig. 10. 11. 14. 13. 15. 16. 12. Common Anode Dig.4 Common Anode Dig.3 Anode Anode Anode Anode Anode Cathode Cathode Cathode Cathode Cathode 14. 15. 16. 13. 12. 7. Anode Cathode Common Cathode Dig. Anode Anode Cathode Common Cathode Dig. Anode Anode 7. Cathode Cathode Cathode Anode DP3 11. 10. Cathode Cathode Anode PIN NO. Electrical Connection LFD4162-XX-PF Common Anode Dig. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD4152-XX-PF Common Cathode Dig.1. PIN NO. 1. 11 DP1,DP2 A B G C A B G DP1,DP2 C DP3 DP3 F DP DP1,DP2 E D DP3 F DP DP1,DP2 E D Page 3/8LFD415/62-XX-PF PART NO.

Max. Part Selection And Application Information(Ratings at 25)℃ LFD4162-XX-PF LFD4152-XX-PF PART NO Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Operating Temperature Storage Temperature (nm) common cathode or anode λP (nm) Common Anode Common Cathode GaP Material Green Emitted 56530 Typ. 1.7 Min. 2.12.6 Topr Tstg CHIP Vf(v) -25 ~ +85 -25 ~ +85 3.05 Typ. 1.75 Min. 2:1 Iv(mcd) IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Symbol IF PD Ir IFP Parameter 100 120 Ratings G 4/8Page mW μA mA mA UNIT LFD415/62-XX-PF PART NO.

Luminous Intensity Matching Ratio IV-M Test Condition For Each Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Peak Wavelength Parameter 5/8Page Vf volt Ir Iv λp μA nm mcd nm Symbol Unit If=20mA Vr=5V If=20mA If=10mA If=20mA Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD415/62-XX-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity @20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8LFD415/62-XX-PF PART NO.

PART NO.LFD415/62-XX-PF Page 7/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

PART NO.LFD415/62-XX-PF MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Solder Resistance Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Reliability Test: Operating Life Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description Reference Standard Page8/8