LFD315-62-XX-PF

LFD315-62-XX-PF LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LFD315/62-XX-PF FOUR DIGIT LED DISPLAY (0.36 Inch) 15 - Dec. DOC. NO : QW0905- REV. : A DATE : - 2005 LFD315/62-XX-PF

B C GF E A D DP 1/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LFD315/62-XX-PF PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 10.72 (0.422") ψ1.0(0.039") 14.0 (0.551") 7.1(0.28") DIG.4DIG.2 DIG.3 9.2 (0.36") DIG.1 2.54X5=12.7 (0.5") Ø 0.51 TYP LFD315/62-XX-PF LIGITEK 29.5(1.161") 4.3±0.5

2/8 PART NO. Internal Circuit Diagram LFD3152-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD3162-XX-PF Page A B C D F E DIG.1 B A DP E D G F C DIG.2 G A B D C F E DIG.1 DP B A D E G F C DIG.2 G B C A E G F DP D 8 DIG.3 A C D B E F G DP DIG.4 C B A E G DP F D DIG.3 A C D B F E DP G DIG.4 DPDP

Common Anode Dig.2 Common Anode Dig.3 Common Anode Dig.4 Electrical Connection PART NO. Anode E1 PIN NO.1 Anode D Anode C

3 Anode DP

9 Common Cathode Dig.2 Common Cathode Dig.3 Common Cathode Dig.4 PIN NO.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Cathode A Common Anode Dig.1 Anode A11 12 Common Cathode Dig.1

μA UNIT Typ. IV-M 1.752:1 Ratings 100 120 G -25 ~ +85 -25 ~ +85 IF IFP PD Ir Topr Tstg Parameter Symbol Operating Temperature Storage Temperature Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ PART NO. Min. Vf(v) Min.Max. 1.01.72.6 (nm) 30565 Electrical Common Cathode Common Anode CHIP Material GaP Green Emitted common cathode or anode λP (nm)PART NO LFD3152-XX-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LFD3162-XX-PF Iv(mcd) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD315/62-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA If=10mA If=20mA If=20mA Vr=5V volt nm nm mcd Vf λP Iv μAIr IV-M Symbol Unit Test Condition PART NO. Forward Voltage Per Chip Luminous Intensity Per Chip Spectral Line Half-Width Peak Wavelength Reverse Current Any Chip Parameter Luminous Intensity Matching Ratio Test Condition For Each Parameter LFD315/62-XX-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 6/8LFD315/62-XX-PF

Page 7/8 PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0

60 Seconds Max

This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Thermal Shock Test High Temperature High Humidity Test Solder Resistance Test Solderability Test PART NO. Test Item Operating Life Test High Temperature Storage Test Low Temperature Storage Test Reliability Test: LFD315/62-XX-PF