LFD265-62-XX LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : - 200507 - Jul LFD265/62-XX DATA SHEET LFD265/62-XX FOUR DIGIT LED DISPLAY (0.28 Inch)

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LFD265/62-XX Package Dimensions PART NO. Page 1/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD265/62-XX Internal Circuit Diagram PART NO. Page 2/7 2C2 AA B DIG. 4 G DP F E D C DIG. 3 F A DP G D E C B DIG. 4B G DP F C D DIG. 3 F A DP G D E 11 C B D G DP E F DIG. 2 DP B C A F G E D D G DP F E 14 DIG. 2 DP B C A F G E D LFD2652-XX LFD2662-XX DIG. 1 A B 15 13 DIG. 1 A B C

PART NO. PIN NO.1 Anode F Anode B,L2 Cathode F Cathode B,L2 Anode A ,L1 NC Common Cathode Dig.4 Anode D NC9 Anode G7 Cathode A,L1 NC Cathode D Common Anode Dig.4 Cathode G NC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD2662-XX NC Common Cathode Dig.11 Anode C,L3 NC Anode DP3 Anode E LFD265/62-XX LFD2652-XX Common Anode Dig.11 Cathode C,L3 Cathode E Cahtode DP3 PIN NO.1 Page 3/7 Common Cathode Dig.3 Common Anode Dig.3 Common Cathode L1,L2,L3 Common Anode L1,L2,L3 Common Cathode Dig.2 Common Anode Dig.2

μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page UNIT Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25 )℃ LFD2652-XX PART NO LFD2662-XX λP (nm) CHIP common cathode or anodeEmitted GaP Green Material Common Anode Common Cathode 565 Electrical 2.1 Vf(v) Typ. 30 1.7 (nm) Min. 1.752.6 3.05 Min.Max. Typ. Iv(mcd) LFD265/62-XX Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Forward Current Per Chip Power Dissipation Per Chip Operating Temperature Storage Temperature Reverse Current Per Any Chip Absolute Maximum Ratings at Ta=25 ℃ Parameter Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO. Symbol Tstg Topr Ir PD IFP IF -25 ~ +85 -25 ~ +85 100 120 G Ratings 2:1 IV-M

Luminous Intensity Matching Ratio Luminous Intensity Per Chip Test Condition For Each Parameter Parameter Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength Forward Voltage Per Chip LFD265/62-XX PART NO. Symbol Unit Test Condition IV-M Ir μA Iv λP Vf mcd nm nm volt Vr=5V If=20mA If=10mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. 6/7LFD265/62-XX

Reliability Test: High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item PART NO. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. LFD265/62-XX Test Condition Description Page 7/7