LDUR13732-S7-PF LIGITEK | Alldatasheet

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SUPER BRIGHT ROUND TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LDUR13732/S7-PF 10 - May. DOC. NO : QW0905- REV. : DATE : B - 2006 LDUR13732/S7-PF

5.95.0 1.5MAX 7.6 8.6 2.54TYP 25.0MIN □0.5 TYP 1.0MIN 100% 75% 50% -60° -30° 60° 30° 1/5PART NO. Package Dimensions LDUR13732/S7-PF Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page

λDnm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LensEmitted AlGaInPLDUR13732/S7-PF White DiffusedRed Operating Temperature Topr MATERIALPART NO COLOR Storage Temperature Tstg Forward Current IF Peak Forward Current Duty 1/10@10KHz Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation ESD Ir IFP PD Parameter Symbol Typ.Max.Min. Min. 115001.720 2.6 7700 28 ℃-40 ~ +85 Luminous intensity @20mA(mcd) Forward voltage @ mA(V) Spectral halfwidth △λnm 20 Viewing angle 2θ 1/2 (deg) -40 ~ +100 ℃ mA30 150 120 V μA mA mW Ratings DUR UNIT Page 2/5LDUR13732/S7-PFPART NO. Static Electricity or power surge will damage the LED. Use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @20℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @20℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Light Output Power vs. Forward Current LOP(%) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 0.0 100 0.0 20 40 60 -2.0 -0.05 550 600 0.0 0.5 1.0 0.5 1.5 2.0 3.0 80 90 0.0 500 DUR CHIP 3/5Page 1.0 2.5 120 30 50 70 -0.15 -0.1 4020 30 50 70 60 80 90 0.2 0.4 0.6 0.8 1.0 1.2 650 700 20 40 60 800.0 100 120 140 100 120 140 LDUR13732/S7-PFPART NO.

60 Seconds Max

260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0 Page 4/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) LDUR13732/S7-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: LDUR13732/S7-PFPART NO. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=105 (10min) (10min) 2.total 10 cycles MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) High Temperature Storage Test High Temperature High Humidity Test Low Temperature Storage Test Operating Life Test Test Item The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition Description MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1