LDGL13732-S10-OD LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : DATE : DATA SHEET ROUND TYPE LED LAMPS LDGL13732/S10-OD LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDGL13732/S10-OD 30 - Jun.- 2006 A Pb Lead-Free Parts
5.95.0 1.5MAX 7.6 8.6 2.54TYP 25.0MIN □0.5 TYP 1.0MIN -30° 30 -60° 60° Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGL13732/S10-OD Page 1/5
Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol ESD Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. COLOR Lens InGaN/GaN MATERIAL LDGL13732/S10-OD PART NO Green Emitted Peak Forward Current Duty 1/10@10KHz Forward Current Electrostatic Discharge( * ) Operating Temperature Reverse Current @5V Storage Temperature Power Dissipation Parameter 5000 Luminous intensity @20mA(mcd) Typ. Spectral halfwidth △λnm Dominant wave length λDnm 4.0 Max. Forward voltage @ mA(V) 3.5 Typ. 2700 Min. Viewing angle 2θ 1/2 (deg) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ir 50 150 120 100 Ratings DGL μA V mW mA mA UNIT Page 2/5 -20 ~ +80 -30 ~ +100 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LDGL13732/S10-ODPART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 DGL CHIP Page 3/5 450 0.0 0.5 1.0 500 550 600 LDGL13732/S10-ODPART NO.
5°/sec max 2°/sec max
60 Seconds Max
25° 0°0 50Preheat 120° 100 150 Time(sec) Temp(°C) 260° 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDGL13732/S10-ODPART NO.
This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/5PageLDGL13732/S10-ODPART NO.