LDD805-65-XX-PF LIGITEK | Alldatasheet
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DOC. NO : QW0905-LDD805/65-XX-PF-08 REV. : A DATE : 10 - Dec. - 2008 LDD805/65-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DUAL DIGIT LED DISPLAY (0.8 lnch) Pb Lead-Free Parts
2.54X8=20.32 (0.8") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PIN NO.1 ∅0.51TYP A D 4.3±0.5 F E G B C DP 35.6(1.402") 20.1 (0.8") PIN 1 DIG.1 Package Dimensions PART NO. LDD805/65-XX-PF 22.0 (0.866") 10.0(0.394") ψ2.0(0.079") 25.7 (1.012") PIN 9 DIG.2 Page 1/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN 18 PIN 10
C DIG.1 AB DE GF 11 10 685 912 7 E DIG.2 AB CD FG DP Page 2/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD8055-XX-PF GB DIG.1 A 1615 FEDC 13 2 18 17 Internal Circuit Diagram PART NO. LDD805/65-XX-PF D CBDP A 10411 86 DIG.2 DPGFE 7125 9
Cathode E Dig.2 Cathode D Dig.2 Cathode C Dig.2 Common Anode Dig.2 Cathode B Dig.2 Cathode F Dig.2 Cathode A Dig.2 Cathode G Dig.2 Cathode C Dig.1 Cathode E Dig.1 Cathode D Dig.1 Cathode DP Dig.2 Cathode DP Dig.1 Cathode B Dig.1 Cathode G Dig.1 Cathode F Dig.1 Cathode A Dig.1 Common Anode Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Anode C Dig.2 Anode B Dig.2 Anode F Dig.2 Anode A Dig.2 Anode DP Dig.2 Anode A Dig.1 Anode F Dig.1 Anode G Dig.1 Anode B Dig.1 Common Cathode Dig.2 Common Cathode Dig.1 PART NO. LDD805/65-XX-PF Anode E Dig.2 Anode D Dig.2 Anode C Dig.1 Anode E Dig.1 Anode D Dig.1 Anode DP Dig.1 Anode G Dig.2 Electrical Connection PIN NO. LDD8055-XX-PF PIN NO. Page 3/8 LDD8065-XX-PF
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LDD8065-XX-PF LDD8055-XX-PF PART NO Common Anode common cathode or anode Common Cathode Red GaAlAs CHIP EmittedMaterial 66020 λP (nm) (nm) Iv(mcd) 1.52.14.0 Electrical Min. Typ. Vf(v) Min. 6.12:1 Typ. IV-M PART NO. LDD805/65-XX-PF Parameter Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Storage Temperature Operating Temperature Reverse Current Per Any Chip Ratings -40 ~ +85 -400 ~ +100Tstg Topr Ir PD Symbol IFP IF μA mW Red mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4/8Page
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reverse Current Any Chip Forward Voltage Per Chip Luminous Intensity Per Chip Parameter Luminous Intensity Matching Ratio Spectral Line Half-Width Peak Wavelength IV-M Ir μA nm λP Symbol Vf Iv volt mcd nm Unit PART NO. LDD805/65-XX-PF Test Condition For Each Parameter If=20mA Vr=5V If=10mA If=20mA If=10mA Test Condition 5/8Page
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Current Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP PART NO. LDD805/65-XX-PF Page6/8
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
260° 0° 0 25° 120° Temp(°C) 260°C3sec Max 100Preheat 50 2°/sec max 5°/sec max Time(sec) 150 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 2.Wave Soldering Profile PART NO. LDD805/65-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test Solderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Test Item High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours.
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. PART NO. LDD805/65-XX-PF Reference Standard Page8/8