LDD425-65-XX-PF

LDD425-65-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-LDD425/65-XX-PF-B01 REV. : A DATE : 28- Jun. - 2009 LDD425/65-XX-PF DATA SHEET DUAL DIGIT LED DISPLAY (0.40 lnch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子

12.7 (0.5") 10.16 (0.4") ψ1.3(0.051") 16.0 (0.63") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. 2.54X4= 10.16(0.40") LDD425/65-XX-PF LIGITEK Ø 0.51 TYP PIN 1 6.9 (0.27") PIN 6 A D E C DP G F B 6.9 (0.272") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD425/65-XX-PF Package Dimensions DIG.1 20.2 (0.795") PIN 10 PART NO. PIN 7 DIG.2 Page 1/8 5.2±0.5 PIN NO.1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD4265-XX-PF DIG.2 LDD4255-XX-PF 7 8643 192 A DIG.1 CB ED DPFG BA DIG.2 64132 98 LDD425/65-XX-PF DIG.1 Internal Circuit Diagram PART NO. CBA D E DPFG A B EDC GF DP GCD FE DP 2/8Page

Common Cathode Dig.1 Common Cathode Dig.2

8 Anode F

6 Anode B

Common Anode Dig.1 Common Anode Dig.2

8 Cathode F

6 Cathode B

LDD4255-XX-PFPIN NO. Anode DP Anode E 3 Anode D1 PART NO. LDD4265-XX-PFPIN NO. Cathode DP Cathode E 3 Cathode D1 Page3/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LDD4255-XX-PF LDD4265-XX-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaAlAs Red Emitted CHIP △λ (nm) λP (nm) common cathode or anode 66020 Tstg Topr Max. 2.41.5 1.7 Min. Typ. 5.08.5 Min.Max. Electrical Vf(v)Iv(mcd) IV-M 2:1 PART NO. Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 100 SR Page 4/8LDD425/65-XX-PF Common Anode

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip PART NO. mcdIv λP nm μA nm Unit Vfvolt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8LDD425/65-XX-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 6/8LDD425/65-XX-PF PART NO.

60 Seconds Max

Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

0 Preheat

25° 120° 2°/sec max 260° 15010050 Time(sec) 260°C3sec Max 5°/sec max Page 7/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(°C) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C PART NO. LDD425/65-XX-PF

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reliability Test: PART NO. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test ItemTest Condition JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference StandardDescription 8/8PageLDD425/65-XX-PF