LDD405-61-XX-PF

LDD405-61-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-LDD405/61-XX-PF REV. : A DATE : 22 - Jun. - 2006 LDD405/61-XX-PF DATA SHEET DUAL DIGIT LED DISPLAY (0.40 lnch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

10.16 (0.40") 16.0 (0.630") 12.6 (0.496") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.45X7= 17.15(0.675") PIN NO.1 Ø 0.51 TYP. LDD405/61-XX-PF LIGITEK F BDIG.2 4.7±0.5 D DP E C ψ1.3(0.051") A LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 20.2 (0.795") DIG.1 Package Dimensions PART NO. LDD405/61-XX-PF DIG.2 6.9 (0.272") Page 1/8

DIG.1 A B C FD E G 31513 1 16142 Internal Circuit Diagram DIG.1 A BC FDE G 710 12 68 11 9 DIG.2 BA DC GFE 7810 12 69 11 Page 2/8 DIG.2 AB CD GEF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD405/61-XX-PF

Cathode D Dig.2 Anode D Dig.2 6 6 Anode B Dig.1 Anode A Dig.1 Anode B Dig.2 Anode F Dig.2 Anode A Dig.2 Anode G Dig.2 Anode C Dig.2 Anode E Dig.2 Anode G Dig.1 Anode F Dig.1 Cathode B Dig.1 Cathode G Dig.1 Cathode A Dig.1 Cathode F Dig.1 Cathode E Dig.2 Cathode C Dig.2 Cathode G Dig.2 Cathode A Dig.2 Cathode B Dig.2 Cathode F Dig.2 PART NO. LDD405/61-XX-PF Electrical Connection Anode C Dig.1 Anode E Dig.1 Anode D Dig.1 Common Cathode Dig.1 Common Cathode Dig.2 LDD4051-XX-PF PIN NO. Common Anode Dig.2 Common Anode Dig.1 Cathode C Dig.1 Cathode E Dig.1 Cathode D Dig.1 3 PIN NO. LDD4061-XX-PF Page 3/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

H 40 mW mA mA UNITSymbol IF IFP PD Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 0.50.35 Typ.Min. 2.11.72.6 Max. Topr Tstg Common Anode 697 common cathode or anode λP (nm) (nm) CHIP Emitted Red GaP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO LDD4061-XX-PF LDD4051-XX-PF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip PART NO. LDD405/61-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λP Iv mcd Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M IrVr=5V PART NO. LDD405/61-XX-PF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/8Page PART NO. LDD405/61-XX-PF

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

60 Seconds Max

0° 0 25° 120° 2°/sec max 260° Temp(°C) 2.Wave Soldering Profile 100 150 Time(sec) 260°C3sec Max 5°/sec max Page 7/8 PART NO. LDD405/61-XX-PF

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Thermal Shock Test High Temperature High Humidity Test Low Temperature Storage Test High Temperature Storage Test Reliability Test: Test Item MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition Description Reference Standard 8/8Page PART NO. LDD405/61-XX-PF