LDD335-62-XXH-PF

LDD335-62-XXH-PF LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD335/62-XXH-PF DATA SHEET DUAL DIGIT LED DISPLAY (0.36 lnch) DOC. NO : QW0905-LDD335/62-XXH-PF REV. : A DATE : 10 - Dec. - 2008 Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LDD335/62-XXH-PF Package Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. A B C D E F G DP ψ1.0(0.039") 4.1±0.5 7.2 (0.283") 14.0 (0.551") 15.0(0.591") ∅ 0.51 TYP PIN NO.1 2.54X4=10.16 (0.4") LDD335/6X-XXH-PF LIGITEK 9.14 (0.36") DIG.1 DIG.2 7.2(0.283") 10.16 (0.4") DIG.2 PIN 1 PIN 5 PIN 6PIN 10

PART NO. LDD335/62-XXH-PF Page 2/8 Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only B DIG.1 B DIG.1 A A LDD3362-XXH-PF D 786 41 2 GFDEC CBADP DIG.2 FGE DP D 78641 2 G LDD3352-XXH-PF C D FE DIG.2 DP A B C E F DPG

PART NO. LDD335/62-XXH-PF Cathode B Page 3/8 Electrical Connection Cathode G Cathode A Cathode F Cathode DP PIN NO. Cathode E PIN NO.

1 Anode G

2 Anode DP

Common Anode Dig.1 Common Cathode Dig.1 LDD3362-XXH-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Dig.2 Common Anode Dig.2 Anode D Cathode D Anode C Cathode C

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LDD3352-XXH-PF LDD3362-XXH-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaP Green Emitted CHIP △λ (nm) λP (nm) common cathode or anode 56530 Tstg Topr Max.Min. Typ. 1.352.0 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 PART NO. Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 120 G Page4/8LDD335/62-XXH-PF Common Anode 1.72.12.6

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip PART NO. mcdIv λP nm μA nm Unit Vfvolt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8LDD335/62-XXH-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 6/8LDD335/62-XXH-PF

PART NO. LDD335/62-XXH-PF Page 7/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C12sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:12 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

PART NO. LDD335/62-XXH-PF 8/8

Description

Reliability Test: Test Item Test Condition The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Low Temperature Storage Test High Temperature Storage Test Operating Life Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Page