LDD305-61-XX LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905-LDD305/61-XX REV. : B DATE : 07 - Jul - 2005 DATA SHEET LDD305/61-XX DUAL DIGIT LED DISPLAY (0.30 lnch)

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO. LDD305/61-XX Page 1/7 ψ1.1(0.043") 4.8±0.5 15.5 (0.610") ψ0.5 TYP. PIN NO.1 2.54X4= 10.16(0.40") 7.62 (0.30") LDD305/61-XX LIGITEK DIG.1 DIG.2 10.16 (0.40") 15.0 (0.591") 7.2 (0.283")

PART NO. LDD305/61-XX Page 2/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DIG.2DIG.1 DIG.1 AB AB DIG.2 C 186 4 7 CD EF AG BG ED F C LDD3061-XX 684 7 CD EF AG B GED F LDD3051-XX 10 5

PART NO. LDD305/61-XX Page 3/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Dig.1 Common Cathode Dig.2 LDD3051-XX Anode B Anode C Anode D Anode E No Pin Anode G Anode F Anode A PIN NO. Cathode A Cathode F Common Anode Dig.2 Cathode C Cathode G Cathode D Cathode E Common Anode Dig.1 Cathode B No Pin2 PIN NO. LDD3061-XX ‧Connection To Electrical Schematic Electrical connection

Part Selection And Application Information(Ratings at 25 )℃ Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Emitted Red Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LDD3061-XX LDD3051-XX GaP PART NO Material CHIP Common Anode Common Cathode 697 common cathode or anode λP (nm) 90 1.7 2.1 2.6 Min. (nm) Vf(v) Typ. Max. Reverse Current Per Any Chip Storage Temperature Operating Temperature Tstg Topr Ir -25 ~ +85 -25 ~ +85 2:10.12 0.2 IV-MIv(mcd) Typ.Min. μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD305/61-XX Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) PART NO. Parameter H IFP PD IF Symbol Ratings mW mA mA UNIT Page 4/7

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA Vr=5V voltVf Forward Voltage Per Chip Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength Luminous Intensity Per Chip IV-M Ir Iv λP μA nm mcd nm Test Condition For Each Parameter Parameter PART NO. LDD305/61-XX Symbol Unit 5/7Page

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700 800 900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200- 4 0 100 0.0 806002 04 0 1 0 0 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA)0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 10 100 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/7PART NO. LDD305/61-XX Page

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Thermal Shock Test Solder Resistance Test High Temperature High Humidity Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Low Temperature Storage Test High Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reliability Test: Test Item Operating Life Test Test Condition LDD305/61-XX PART NO. Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7