LDD215-62-XX-S2-PF

LDD215-62-XX-S2-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL DIGIT LED DISPLAY (0.25Inch) DATA SHEET LDD215/62-XX/S2-PF LDD215/62-XX/S2-PF 12 - Sep. DOC. NO : QW0905- REV. : A DATE : - 2006

9.0 1/8Page PART NO. Package Dimensions LDD215/62-XX/S2-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 0.8 5.0±0.52.5±0.5 3.0±0.5 A B2G 910 FB1 D 54321 C1 E 2.0x4=8.0 (0.315") PIN NO.1 12.4 (0.488") 6.4 (0.252") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LDD215/62-XX/S2-PF LIGITEK 10.4 (0.409") 3.6 (0.142")0.9 (0.035")

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDD2152-XX/S2-PF LDD2162-XX/S2-PF PART NO.LDD215/62-XX/S2-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page3/8 LDD2162-XX/S2-PFPIN NO.1LDD2152-XX/S2-PF Anode D Anode E Anode G Anode C2 Anode C1 1 Cathode C1 Cathode E Cathode D Cathode G Cathode C2 Electrical Connection PIN NO.1 Anode A Anode B2 Anode F Common Cathode Anode B1 10 Cathode B1 Cathode F Cathode A Cathode B2 Common Anode PART NO.LDD215/62-XX/S2-PF

G 120 100 mW mA mA UNITSymbol IF IFP PD Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 0.080.05 Typ.Min. 2.11.72.6 Max. Topr Tstg Common Anode 565 common cathode or anode λP (nm) (nm) CHIP Emitted Green GaP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO LDD2162-XX/S2-PF LDD2152-XX/S2-PF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip PART NO.LDD215/62-XX/S2-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λP Iv mcd Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M Ir Vr=5V PART NO.LDD215/62-XX/S2-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP 6/8 PART NO.LDD215/62-XX/S2-PF

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C

60 Seconds Max

25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO.LDD215/62-XX/S2-PF

StandardDescriptionTest Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Reliability Test: High Temperature Storage Test Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Operating Life Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 PART NO.LDD215/62-XX/S2-PF