LDD205-64-XX-PF

LDD205-64-XX-PF LIGITEK | Alldatasheet

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DUAL DIGIT LED DISPLAY (0.28 lnch) LDD205/64-XX-PF DATA SHEET DOC. NO : QW0905-LDD205/64-XX-PF REV. : B DATE : 24 - Sep. - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

Page 1/8 PART NO. LDD205/64-XX-PF Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 7.62 (0.3") 6.0 (0.236") 7.0 (0.28") LDD205/64-XX-PF 2.54X4=10.16 (0.4") Ø 0.45 TYP LIGITEK 15.0(0.591") 10.0 (0.394") 6.2±0.5 PIN 1PIN 5 PIN 10 PIN 6 PIN NO.1 ∅0.75(0.030")

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 Internal Circuit Diagram PART NO. LDD205/64-XX-PF DIG.1 A A DIG.1 CBAFD EGB C 238110 54 LDD2064-XX-PF DIG.2 DP GFED DP 2381105 4 LDD2054-XX-PF DBC FE DIG.2 ADPG CB FED DPG

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 Electrical Connection Common Cathode Dig.1 Common Cathode Dig.2 LDD2054-XX-PF Anode F10 Anode DP Anode D Anode G Anode C Anode E PIN NO. Cathode F10 Cathode DP Common Anode Dig.1 Common Anode Dig.2 Cathode G Cathode C Cathode D Cathode E PIN NO. LDD2064-XX-PF PART NO. LDD205/64-XX-PF Anode A Anode B Cathode A Cathode B

E Parameter Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only μA Min. Typ. Iv(mcd) IV-M 1.00.5 2:1 -25 ~ +85 -25 ~ +85 Ir Topr Tstg Operating Temperature Storage Temperature Reverse Current Per Any Chip Max.Typ. Vf(v)△λ (nm) Min. 2.62.11.745 λP (nm) common cathode or anode 635 Common Cathode Common Anode CHIP Material PART NO GaAsP/GaP LDD2054-XX-PF LDD2064-XX-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Orange Emitted Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Electrical PART NO. LDD205/64-XX-PF

Test Condition For Each Parameter nm mcd nm μA λP Iv Ir IV-M Luminous Intensity Per Chip Peak Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Forward Voltage Per Chip Vfvolt Vr=5V If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDD205/64-XX-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E CHIP Page6/8 PART NO. LDD205/64-XX-PF

Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C

60 Seconds Max

25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO. LDD205/64-XX-PF

1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Thermal Shock Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Low Temperature Storage Test High Temperature Storage Test Reliability Test: Test ItemTest Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference StandardDescription 8/8 PART NO. LDD205/64-XX-PF