LDBK3333-S46-A-B01 LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET ROUND TYPE LED LAMPS LDBK3333/S46/A-B01 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDBK3333/S46/A-B01 08-Mar. - 2017 A Lead-Free Parts Pb 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/S46/A-B01 Page 1/7 8.6 5.0 5.9 1.5MAX 0.5 TYP 1.0MIN 25.0MIN 2.54TYP 7.6 + - 60° 30° 100%50%0 25% 75% -30° -60° 25%75%50%100%

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ IFP PD IF Tstg Topr ESD Symbol Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current 120 -30 ~ +100 -20 ~ +80 Ir 500 Ratings DBK 100 mW V μA mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 Viewing angle 2θ 1/2 (deg) Min. 5000 2.8 Forward voltage @ mA(V) Max. 4.0 Spectral halfwidth △λnm Max. Luminous intensity @20mA(mcd) 7700 Emitted Blue PART NO LDBK3333/S46/A-B01 MATERIAL InGaN Lens COLOR Water Clear Dominant wave length λDnm 471 PART NO. LDBK3333/S46/A-B01 Min. 465 Min.Max.

Min.Max. Wave length(nm) at 20 mA 471 Color Code DBK CHIP Group A2950006200 Brightness Code For Standard LED Lamps Luminous Intensity(mcd) at 20 mA Group Min. DBK CHIP LDBK3333/S46/A-B01PART NO. Max. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/7Page 6200 7700A30 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. 3.The dominant wavelength data did not including ±1nm testing tolerance.

Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DBK CHIP 4/7PagePART NO. LDBK3333/S46/A-B01 1000 100 3.0 2.5 Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000100 2.0 1.5 1.0 0.5 0.0 1015.02.0 Forward Voltage(V) Forward Current(mA) Forward Current(mA) Relative Intensity Normalize @20mA 3.01.2 Fig.3 Forward Voltage vs. Temperature 2.0 1.0 1.5 1.1 0.9 1.0 2.5 Fig.4 Relative Intensity vs. Temperature 408010060 0.0 20406080100-20 -400 0.8 -40-200 Ambient Temperature(℃) Ambient Temperature(℃) Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 0.5 0.5 550500400 0.0 450 Wavelength (nm) Relative Intensity@20mA 1.0 0 1 4.03.01.0 Fig.5 Relative Intensity vs. Wavelength

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Temp(°C) 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max 100 150 Time(sec) 120° Preheat 50 25° 00°

60 Seconds Max

2°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 260° PART NO. LDBK3333/S46/A-B01

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference StandardTest Item Operating Life Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Description

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature Storage Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles Thermal Shock Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. PART NO. LDBK3333/S46/A-B01

ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm L C/NO: MADE IN CHINA W H H 2. 8 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L W 1. 500PCS / BAG PACKING SPECIFICATION Page 7/7