LDBK32643

LDBK32643 LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

A - 200627 - Mar. LDBK32643 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LDBK32643 ROUND TYPE LED LAMPS DATA SHEET DOC. NO : QW0905- REV. : DATE : Pb Lead-Free Parts

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 2.54TYP Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK32643 1.0MIN + - 3.0 3.5 4.5 3.16 □0.5 TYP 1.5 MAX 25.0MIN 75%100% 50% -60° -30° 025%25%75% 50%100% 60° 30°

@20mA(mcd) Typ. Spectral halfwidth △λnm 470 Dominant wave length λDnm 4.0 Max. Forward voltage @ mA(V) 3.5 Typ. 900 Min. Viewing angle 2θ 1/2 (deg) 2/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA V mW 100 DBK Ratings 150 Ir -20 ~ +80 -30 ~ +100 120 PART NO. Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Storage Temperature Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol ESD Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LDBK32643 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP Page3/5 LDBK32643 PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0

60 Seconds Max

LDBK32643 PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LDBK32643 PART NO.