LDBK2641Z

LDBK2641Z LIGITEK | Alldatasheet

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22 - Aug. DOC. NO : QW0905- REV. : DATE : B - 2006 LDBK2641Z LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Page 1/5 PART NO. LDBK2641Z Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation °30 60° 100%75%50%25%025% °-30 -60° 100%75%50% DBK Zener 4.33.3 1.5 MAX □0.5 TYP 1.0MIN 25.0MIN 2.54TYP 3.12.9 + -

Duty 1/10@10KHz Reverse Current @5V Electrostatic Discharge( * ) Storage Temperature InGaN/GaN MATERIAL Operating Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) LDBK2641Z PART NO Forward Current V8000ESD Luminous intensity @20mA(mcd) Forward voltage @20mA(V) Blue COLOR EmittedLens 470303.54.0 Spectral halfwidth △λnm wave length λ nmD Dominant Typ. Max. 301500700 Viewing angle 2θ 1/2 (deg) Typ.Min. Topr Tstg -30 ~ +100 -20 ~ +80 ℃ Ir PD IFP IF 120 100 Symbol DBK Ratings μA mW mA mA UNIT Page2/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. LDBK2641Z Blue Transparent

Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP Page3/5 PART NO. LDBK2641Z

60 Seconds Max

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max PART NO. LDBK2641Z

This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/5Page PART NO. LDBK2641Z