LCC AMKOR | Alldatasheet
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Features: CERAMIC / HERMETIC www.amkor.com VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION Leadless Chip Carrier Package (LCC) Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized terminals / pads on the sides and bottom of the package. An LCC package has terminals / pads on all four edges of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside. Applications: This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon, GaAs and S.A.W.). These packages enable end products (pagers, portable audio/video, disc drives, radio, IF & RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs/S.A.W. technologies are well addressed by the LCC product family. The LCC offers a variety of features. From standard industry, Amkor provides a platform from prototype-to-production: Flexible lead / pin counts Variety of body sizes Hermetic package Exceptional thermal and electrical performance by design Multi-layer, ground / power Cavity Up / Cavity down configurations Cavity package DS810 Rev Date: 08’02