LBD801-29-XX LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : - 2009 DATA SHEET LBD801/29-XX LIGHT BAR LED DISPLAY 發行 DCC 立碁電子

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PIN NO.1 PART NO. LBD801/29-XX Package Dimensions Page 1/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 7.00(0.276") 11.00(0.433") 6.20(0.244") 7.0(0.276") 4-1.2 22.00(0.866") 32.00(1.259") 5.085.08 0.45TYP LBD801/29-XX LIGITEK 321

PIN NO. LBD8019-XX LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LBD801/29-XX Internal Circuit Diagram Page 2/7 LBD8029-XX PIN NO. LBD8029-XX Anode Cathode Cathode

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LBD8019-XX AlGaInP PART NO Electrical Common Cathode 605 Orange 2.62.1171.7 λD (nm) common cathode or anodeEmitted Vf(v) Max.Typ. (nm) Min. 2:16850 Typ. IV-M Min. Iv(mcd) Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Forward Current Per Chip Power Dissipation Per Chip Operating Temperature Storage Temperature Reverse Current Per Any Chip Electrostatic Discharge( * ) Absolute Maximum Ratings at Ta=25 ℃ Parameter 30IF mA 2000ESD Tstg Topr -25 ~ +85 -25 ~ +85 PD IFP Ir μA mW mA μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings 9SEF 3/7Page UNIT Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LBD8029-XX Common Anode PART NO.LBD801/29-XX

Luminous Intensity Matching Ratio Parameter Luminous Intensity Per Chip Dominant Wavelength Forward Voltage Per Chip Ir μA nm Vr=5V If=20mA Iv λD Vf mcd nm volt Unit If=10mA If=20mA If=20mA Test Condition Test Condition For Each Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7 PART NO.LBD801/29-XX

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550600 650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 Typical Electro-Optical Characteristics Curve 9SEF CHIP Page5/7 PART NO.LBD801/29-XX

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO.LBD801/29-XX Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

Reliability Test: Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item Solderability Test Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition Description Page7/7 PART NO.LBD801/29-XX