LBD6118DBK-00

LBD6118DBK-00 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : - 200627 - May LBD6118DBK-00 DATA SHEET LBD6118DBK-00 BAR DIGIT LED DISPLAY

18+0.05 -0.0016±0.25 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 17.3+0.00 -0.20 12.7 Ø 0.6 TYP 2+0.20 -0.00 Package Dimensions LBD6118DBK-00 PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/6

PART NO. : LBD6118DBK-00 1Cathode Anode Electrical Connection PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram Page2/6 PART NO.LBD6118DBK-00

Part Selection And Application Information(Ratings at 25)℃ Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LBD6118DBK-00 PART NO Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Electrostatic Discharge( * ) Reverse Current Per Any Chip Storage Temperature Operating Temperature Power Dissipation Per Chip Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) mAIFP μA μA mW CHIP InGaN/GaN Material λD (nm) Blue Emitted 470 Electrical (nm) Typ. 10.53012 Max. Vf(v) 145 Typ. 78.5 Min. 2:1 Iv(mcd) IV-M Tstg Ir ESD Topr PD -25 ~ +85 -25 ~ +85 Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only mA UNIT IF Symbol Ratings 3/6 PART NO.LBD6118DBK-00 DBK 100 120 150 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

Test Condition For Each Parameter Forward Voltage Dominant Wavelength Luminous Intensity Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Parameter Test Condition IV-M Ir μA nm λD Iv Symbol Vf nm mcd Unit volt If=20mA Vr=5V If=20mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4/6PageLBD6118DBK-00 PART NO.

Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP Page5/6 LBD6118DBK-00 PART NO.

Reliability Test: Solder Resistance Test Solderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature.

Description

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of hogh temperature for hours. Page6/6LBD6118DBK-00 PART NO.