LBD5112-XX-PF

LBD5112-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LBD5112-XX-PF 15 - Aug. Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PIN 1 LBD5112-XX-PF LIGITEK 15.0(0.59") Ø0.51 TYP 15.0 (0.59") 11.2(0.44") 7.0±0.5 13.5 (0.53") 5.08 (0.2") LBD5112-XX-PF Page1/7

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO.1 Electrical Connection Page2/7LBD5112-XX-PF PART NO.

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LBD5112-XX-PF PART NO Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaP Green Emitted CHIP △λ (nm) λP (nm) common cathode or anode 56530 Tstg Topr Max. 5.23.44.2 Min. Typ. 7.212.8 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 120 G Page3/7LBD5112-XX-PF PART NO.

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vf volt If=20mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7LBD5112-XX-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 5/7LBD5112-XX-PF PART NO.

Temp(°C) 25° 260° 120° 5°/sec max 260°C3sec Max 50Preheat 2°/sec max Time(sec) 100 150 Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7

60 Seconds Max

LBD5112-XX-PF PART NO.

MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Solder Resistance Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Reliability Test: Operating Life Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description Reference Standard 7/7PageLBD5112-XX-PF PART NO.