LBD141-22-XX-S1-PF

LBD141-22-XX-S1-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 200621 - Feb. DATA SHEET LBD141/22-XX/S1-PF LBD141/22-XX/S1-PF BAR DIGIT LED DISPLAY LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

6.0 (0.24") B C D EFGH5.6 (0.22") 4.2 (0.17") A 4.2 43.6(1.72") 35.0(1.38") 2.54*9=22.86(0.9") Ø 0.45 TYP 4.0 3.0±0.5 1.5 5.0 PART NO. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO.1 LBD141/22-XX/S1-PF LIGITEK Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 3.95 6.65

D 24 53 A 24 3 B C Internal Circuit Diagram 6 7 89 F E G H Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LBD141/22-XX/S1-PF PART NO. AB CDEFGH

5 Cathode D Anode D5

PIN NO.1 LBD1422-XX/S1-PF Cathode A Common Anode Cathode C Cathode B PIN NO.1LBD1412-XX/S1-PF Anode C Anode B Common Cathode Page3/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LBD141/22-XX/S1-PF PART NO.

PART NO Vf(v)△λ (nm) λP (nm) Electrical Iv(mcd) ℃-25 ~ +85Tstg Storage Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Operating Temperature Reverse Current Per Any Chip PD Ir Forward Current Per Chip Parameter IFP IF Symbol -25 ~ +85 100 μA mW 120 Ratings G mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ LBD141/22-XX/S1-PF PART NO.

Luminous Intensity Matching Ratio Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Ir μA nm Vr=5V If=20mA Iv λp Vf mcd nm volt Unit If=10mA If=20mA If=20mA Test Condition Test Condition For Each Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LBD141/22-XX/S1-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8LBD141/22-XX/S1-PF PART NO.

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 150100 Time(sec) 2°/sec max Preheat 50 260°C3sec Max 5°/sec max 120° 260° 25° Temp(°C) LBD141/22-XX/S1-PF PART NO.

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item Operating Life Test Reliability Test: Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test Solder Resistance Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LBD141/22-XX/S1-PF PART NO.