LBD1301-24S-XX LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : D DATE : - 200620 - Jan. DATA SHEET LBD1301/24S-XX LBD1301/24S-XX BAR GRAPH LED DISPLAY(1.3Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO.LBD1301/24S-XX Page1/7 F A (1.5") 12.7 (0.5") Ø 0.45 TYP 1 2 3 3.8±0.5 7(0.26") F A 23.75 (0.93") 12 1011 78 C D G A H J J B F E G D C C D 33.02 (1.3") 2.75 3.25 3.25 2.1 2.0
PART NO. Internal Circuit Diagram LBD1301/24S-XX LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 LBD13024S-XX C D G G H J F D C A D F E J F A C B A D C LBD13014S-XX B J G F D J H G E F D F C A C A A
- Cathode E Cathode F Cathode H Cathode D Anode D Anode F Anode E Anode H 10. PIN NO. Electrical Connection LBD1301/24S-XX PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Cathode J Cathode B Cathode A Cathode C LBD13014S-XX Anode C Anode J Anode B Anode A Common Cathode Page3/7 11. Anode G 11. Cathode G Cathode H12.12. Anode H PIN NO.LBD13024S-XX Common Cathode Common Anode Common Anode
Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LBD13024S-XX LBD13014S-XX PART NO common cathode or anodeMaterialEmitted Common Cathode Common Anode Orange GaAsP/GaP 61045 CHIP λP (nm) (nm) Iv(mcd) Electrical Vf(v) IV-M Absolute Maximum Ratings at Ta=25 ℃ Parameter Forward Current Per Chip Reverse Current Per Any Chip Operating Temperature Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Storage Temperature LBD1301/24S-XX PART NO. -25 ~ +85 -25 ~ +85 Ir Topr Tstg PD IFP IF μA10 mW mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Symbol Page4/7 SE UNIT
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition Luminous Intensity Per Chip Luminous Intensity Matching Ratio Reverse Current Any Chip Forward Voltage Per Chip Peak Wavelength Spectral Line Half-Width IV-M λp Ir Iv Vf nm nm μA volt mcd Test Condition For Each Parameter PART NO.LBD1301/24S-XX Parameter Symbol Unit If=20mA If=20mA Vr=5V If=10mA If=20mA Page5/7 1. 素子規格 (1)表示素子 ----LED (2)表示色 ----橘紅色 (3)輝度 ----250cd (周圍照度 0 Lux 時) (4)壽命 ----輝度半減期 50.000 Hr (5)光亮度 ----無規定 (1dot 內光亮平均) 2. 表示器規格 (1)輝度 ----表示器內及同一LOT內之表示器,輝度無規定. ( 鄰接DOT之輝度差 50% 以下) (2)光亮度 ----無規定 器具規格
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 SE CHIP Page6/7LBD1301/24S-XX PART NO.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Reliability Test: LBD1301/24S-XX Thermal Shock Test High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Operating Life Test PART NO. Test Item MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition Page7/7 Reference Standard