LA08B-8H LIGITEK | Alldatasheet
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DOC. NO : QW0905-L REV. : DATE : - 2005 05 - Jan A A08B/8H DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LH5520 12.5MIN 2.3TYP 1.0MIN □0.5 TYP 3.8 8.06.0 1.5MAX 2.0 5.3 1.8 Package Dimensions LA08B/8H PART NO. Page 1/4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.3TYP 1.0MIN - + □0.5 TYP 5.9 4.4 1.8 6.8X7=47.6 2.0 12.5MIN 56.2±0.5 7.9 5.3 HH HH HH 5.0 7.2 HH
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LA08B/8H GaP 1.5697Red DiffusedRed 1.7 90 2.6 0.5 142 MATERIAL Storage Temperature Soldering Temperature Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO Typ. Luminous intensity @10mA(mcd) Forward voltage @ mA(V) Peak wave length λPnm Emitted Lens COLOR Spectral halfwidth △λnm Min. Max. Min. Viewing angle 2θ 1/2 (deg) Tsol Tstg Max 260℃ for 5 sec Max (2mm from body) -40 ~ +100 ℃ LA08B/8H Page 2/4 PART NO. Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ Forward Current Power Dissipation Parameter 15 mAIF Topr Ir -40 ~ +85 IFP PD μA mA mW Symbol H Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Forward Current(mA)Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) 700 Wavelength (nm) 1.0 Relative Intensity@20mA 600 0.0 0.5 0.9 Forward Voltage@20mA Normalize @25℃ -40 0.8 -20 1.0 1.1 1.2 800 900 1000 3.0 2.0 1.0 1.5 2.5 Fig.4 Relative Intensity vs. Temperature 0.0 0.5 Relative Intensity@20mA Normalize @25℃ 80402006 0 1 0 0 Ambient Temperature(℃) -40 -20 02 04 0 6 08 0 1 0 0 2.0 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage Forward Current(mA) 1.0 1.0 0.1 100 PART NO. H CHIP 1000 3.0 Fig.2 Relative Intensity vs. Forward Current 2.5 2.0 0.5 1.0 1.5 0.0 3.0 4.0 Relative Intensity Normalize @20mA 5.0 1.0 10 100 1000 PageLA08B/8H
The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LA08B/8H 4/4Page PART NO. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) High Temperature Storage Test Operating Life Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) Reliability Test: Test Item Test Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only